H04R2410/03

DIFFERENTIAL CONDENSER MICROPHONE
20230199407 · 2023-06-22 ·

A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm. Compared to the related art, the microphone can achieve higher sensitivity, higher signal-to-noise ratio, better capacity in suppressing linear distortion, and improve anti-interference capacity, thereby achieving longer signal transmission distance and better audio performance.

SENSOR AND/OR TRANSDUCER DEVICE AND METHOD FOR OPERATING A SENSOR AND/OR TRANSDUCER DEVICE HAVING AT LEAST ONE BENDING STRUCTURE, WHICH INCLUDES AT LEAST ONE PIEZOELECTRIC LAYER
20170352795 · 2017-12-07 ·

A sensor and/or transducer device having at least one bending structure including at least one piezoelectric layer in each case, using which an intermediate volume between at least two electrodes of the bending structure is at least partially filled in each case, the sensor and/or transducer device including an electronic unit, which is designed to apply at least one predefined or established actuator voltage between two of the electrodes at a time of the bending structure in such a way that a deformation of the bending structure triggered by an intrinsic stress gradient in the bending structure may be at least partially compensated for. A method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layer, and a method for calibrating a microphone having at least one bending structure, which includes at least one piezoelectric layer, are also described.

COMBINED CORRUGATED PIEZOELECTRIC MICROPHONE AND CORRUGATED PIEZOELECTRIC VIBRATION SENSOR

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

Microphone device

The microphone device includes a tubular support of a conductive material. A microphone unit is provided at one end of the support and grounded to the support. A cable passes through the support and includes core wires connected to a signal output terminal of the microphone unit. A conductive covering material that covers the core wires and is electrically connected to the support.

ACOUSTIC RESISTANCE IMPROVEMENT IN PIEZOELECTRIC MICROELECTROMECHANICAL SYSTEM MICROPHONE USING COMPLIANT JOINT
20230188896 · 2023-06-15 ·

A piezoelectric microelectromechanical system microphone comprises a support substrate, a cantilever sensing element including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the cantilever sensing element the cantilever sensing element divided into a plurality of cantilevers having gaps between side edges of adjacent cantilevers, and a compliant material disposed in at least a portion of the gaps between adjacent cantilevers to improve the performance of the piezoelectric microelectromechanical system microphone.

MICROELECTROMECHANICAL SYSTEM MICROPHONE ARRAY CAPSULE
20230188904 · 2023-06-15 ·

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

Offset cartridge microphones

Offset cartridge microphones are provided that include multiple unidirectional microphone cartridges mounted in an offset geometry. Various desired polar patterns and/or desired steering angles can be formed by processing the audio signals from the multiple cartridges, including a toroidal polar pattern. The offset geometry of the cartridges may include mounting the cartridges so that they are immediately adjacent to one another and so that their center axes are offset from one another. The microphones may have a more consistent on-axis frequency response and may more uniformly form desired polar patterns and/or desired steering angles by reducing the interference and reflections within and between the cartridges.

Silicon-Based Microphone Apparatus And Electronic Device

Provided are a silicon-based microphone device and an electronic apparatus. The silicon-based microphone device comprises: a circuit board, wherein at least two sound inlets are formed on the circuit board; a shielding housing that covers one side of the circuit board; an even number of differential silicon-based microphone chips that all are located in a sound cavity, wherein in each two differential silicon-based microphone chips, the first microphone structure of one differential silicon-based microphone chip is electrically connected to the second microphone structure of the other differential silicon-based microphone chip, and the second microphone structure of said one differential silicon-based microphone chip is electrically connected to the first microphone structure of said other differential silicon-based microphone chip; and a mounting plate, wherein an even number of holes communicated with the sound inlets are formed on the mounting plate.

DYNAMIC BEAMFORMING TO IMPROVE SIGNAL-TO-NOISE RATIO OF SIGNALS CAPTURED USING A HEAD-WEARABLE APPARATUS

Method to perform dynamic beamforming to reduce SNR in signals captured by head-wearable apparatus starts with microphones generating acoustic signals. Microphones are coupled to first stem of the apparatus and to second stem of the apparatus. First and second beamformers generate first and second beamformer signals, respectively. Noise suppressor attenuates noise content from the first beamformer signal and the second beamformer signal. Noise content from first beamformer signal are acoustic signals not collocated in second beamformer signal and noise content from second beamformer signal are acoustic signals not collocated in first beamformer signal. Speech enhancer generates clean signal comprising speech content from first noise-suppressed signal and second noise-suppressed signal. Speech content are acoustic signals collocated in first beamformer signal and second beamformer signal.

HIGH SENSITIVITY MICROPHONE
20170332177 · 2017-11-16 · ·

A high sensitivity microphone may include a sound detecting module including a vibration film and a fixed film, a power source circuit supplying a power source to the sound detecting module through a switch control of a first switch applying a first bias and a second switch applying a second bias, a detecting circuit removing a noise included in a first capacitance signal and a second capacitance signal that are differential input from the sound detecting module, according to a switch control of a third switch inputting the first capacitance signal in conjunction with the first switch and a fourth switch inputting the second capacitance signal in conjunction with the second switch, and a switch controller performing a first switch mode linking the first switch and the third switch and a second switch mode linking the second switch and the fourth switch for differential input and output of the microphone.