Provided are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises a circuit board, a shielding housing and at least two differential silicon-based microphone chips, wherein at least two sound inlet holes are provided on the circuit board, the shielding housing covers one side of the circuit board and forms a sound cavity with the circuit board, the silicon-based microphone chips are all located inside the sound cavity, the differential silicon-based microphone chips are respectively disposed at the sound inlet holes, and a back cavity of each differential silicon-based microphone chip is communicated with the sound inlet hole at the corresponding position, each of the differential silicon-based microphone chips comprises a first microphone structure and a second microphone structure, all of the first microphone structures are electrically connected, and all of the second microphone structures are electrically connected.

A bone conduction microphone includes a housing having an opening, a microphone pad, an element support member, a piezoelectric element, and a drive plate. The microphone pad is formed in a bottomed tubular shape having a bottom portion disposed outward and a tubular portion with an outer circumference fixed to an inner circumference of the opening. The element support member has an outer circumference fixed to an inner circumference of the tubular portion, and a support portion projecting toward the bottom portion. The piezoelectric element is in a plate shape with a peripheral edge of one surface fixed to the support portion and picks up vibration. The drive plate has a diaphragm part fixed to an inward surface of the bottom portion, and the diaphragm part is provided at a center with a protrusion fixed to an element central portion on another surface of the piezoelectric element.

Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

According to an embodiment, a circuit includes a high-Ω resistor including a plurality of semiconductor junction devices coupled in series and a plurality of additional capacitances formed in parallel with the plurality of semiconductor junction devices. Each semiconductor junction device of the plurality of semiconductor junction devices includes a parasitic doped well capacitance configured to insert a parasitic zero in a noise transfer function of the high-Ω resistor. Each additional capacitance of the plurality of additional capacitances is configured to adjust a parasitic pole in the noise transfer function of the high-Ω resistor in order to compensate for the parasitic zero.

A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

A digital camera includes an optical assembly and image sensor for capturing still and/or video images and displaying the images on a screen. The camera includes three or more spaced apart microphones aligned with the optical assembly for capturing audio during image capture. At least two pairs of microphones are spaced apart along orthogonal directional axes for capturing left-right stereo sound in any camera orientation.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.

A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.