An electronic device is provided. The electronic device includes a printed circuit board (PCB) on which a plurality of PCBs is stacked and comprising a hole penetrating the plurality of PCBs, a microphone disposed on a first surface of the PCB and to which a sound is delivered through the hole, and an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone.

A microphone device includes a substrate having a first surface, a wall disposed on the first surface, a microelectromechanical systems (MEMS) transducer, and an integrated circuit. Both the MEMS transducer and the integrated circuit are mounted on the first surface of the wall. The wall separates the MEMS transducer from the integrated circuit and acoustically isolates the MEMS transducer from the integrated circuit. The microphone device additionally includes a first set of wires extending through the wall and electrically connecting the MEMS transducer to the integrated circuit. The microphone device further includes a second set of wires electrically connecting the integrated circuit to a conductor on the substrate.

A sound transducer, including: a substrate including a cavity and a first surface oriented to the cavity; a fixed part extending from the first surface into the cavity, and including a fixed end disposed on the first surface and a free end opposite to the fixed end; a moving part fixed on the substrate and disposed over the cavity, partially covering the cavity, and including a second surface oriented to the cavity; a first electrode, fixed on the free end; and a second electrode fixed on the second surface. The first electrode is laterally adjacent to the second electrode. The sound transducer has higher sensitivity and the first electrode has stronger stability, thereby improving the performance of the sound transducer.

A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Method to perform dynamic beamforming to reduce SNR in signals captured by head-wearable apparatus starts with microphones generating acoustic signals. Microphones are coupled to first stem of the apparatus and to second stem of the apparatus. First and second beamformers generate first and second beamformer signals, respectively. Noise suppressor attenuates noise content from the first beamformer signal and the second beamformer signal. Noise content from first beamformer signal are acoustic signals not collocated in second beamformer signal and noise content from second beamformer signal are acoustic signals not collocated in first beamformer signal. Speech enhancer generates clean signal comprising speech content from first noise-suppressed signal and second noise-suppressed signal. Speech content are acoustic signals collocated in first beamformer signal and second beamformer signal.

The disclosure provides a microphone chip, a microphone, and a terminal device. The microphone chip includes a substrate and a diaphragm that are disposed oppositely, a reflector located on a side that is of the diaphragm and that is close to the substrate, a grating group located between the substrate and the diaphragm, and an optical emitter and an optical detector that are located between the substrate and the grating group. The grating group includes a plurality of gratings, and distances between at least two gratings in the plurality of gratings and the reflector are different.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.

A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.

An integrated circuit connectable to a sensor includes a transconductance element and a current-input analog-to-digital converter (I-ADC). The transconductance element is connectable to the sensor and is configured to generate a current signal representative of an output of the sensor. The I-ADC is configured to sample and quantize the current signal to generate a corresponding digital sensor signal. The I-ADC includes a continuous-time (CT) integrator stage, a discrete-time (DT) integrator stage, and a feedback digital-to-analog converter (FB-DAC). The CT integrator stage is configured to receive the current output and the I-ADC is configured to generate the digital sensor signal based on an output of the CT integrator stage and an output of the DT integrator stage. The FB-DAC is configured to provide a feedback signal based on the digital sensor signal for adding to the current signal.

A MEMS capacitive microphone according to the present invention is configured such that a support plate 120 from which an inside thereof has been removed in a plane is attached to supports 110 each having an end fixed to a substrate 100, an anchor 130 is attached to an edge region of the support plate 120, an edge of a diaphragm 200 is supported by the anchor 130, and a “substrate-free area” includes the anchor 130 in a plan view, and pluralities of moving comb fingers 300 and stiffeners are attached to a top or bottom or a top and bottom of the diaphragm 200, and the supports 110 support the stationary comb fingers 400 arranged at predetermined intervals on both sides of the moving comb fingers 300 in a plan view.