H04R2410/07

Windscreen mesh

An acoustic mesh comprising a first portion that is acoustically closed; and a second portion that surrounds the first portion and is acoustically open, wherein a surface area of the second portion is at least one percent a total surface area of the acoustic mesh.

AUDIO PROCESSING METHOD AND ELECTRONIC DEVICE

The present disclosure provides an audio processing method for an electronic device, the electronic device includes a main microphone, an auxiliary microphone, and a sound pickup protection structure performing at least one of: weakening an air current entering the sound pickup cavity of the auxiliary microphone from an external environment, or blocking a nongaseous substance from entering the sound pickup cavity of the auxiliary microphone. The audio processing method includes: obtaining a main audio signal collected by the main microphone and an auxiliary audio signal collected by the auxiliary microphone, and synthesizing a target audio signal from the main audio signal and the auxiliary audio signal. The audio processing method improves the quality of audio collected by the electronic device.

Unmanned aircraft, information processing method, and recording medium

An unmanned aircraft includes: a processor; and at least two generators that generate thrust for the unmanned aircraft to fly, the at least two generators each including a corresponding one of rotor blades that produce airflows. In the unmanned aircraft, the processor generates a control request for changing a rotational speed of at least one of the rotor blades of the at least two generators to reduce a difference between rotational speeds, in response to start of sound recording by a microphone, and the at least two generators rotate the rotor blades in accordance with the control request.

System and method for haptic stimulation

A system for haptic stimulation includes: an actuation subsystem having a set of actuators, a support subsystem, a rigid housing, a sensor subsystem, a control module, and an electrical subsystem. A method for manufacturing a system for haptic stimulation includes performing a set of injection molding processes to form the support subsystem and/or the rigid housing; integrating the actuation subsystem within the support subsystem; and coupling the rigid housing to the support subsystem.

Microphone Assembly, Filter for Microphone, Process for Assembly and Manufacturing Microphone and Filter for Microphone, and Method for Filtering Microphone

A microphone assembly can include a microphone capsule having a diaphragm and a diaphragm cover, a grill for protecting the microphone capsule, and a filter material placed between the grill and the diaphragm cover. The microphone assembly can include a first air gap between the grill and the filter material to create a first interface, a second air gap between the filter material and the diaphragm cover to create a second interface, and a third air gap between the diaphragm cover and a diaphragm to create a third interface. The first interface, the second interface, and the third interface are each configured to create turbulence to assist in draining off energy from plosives and wind and reduce intensity of disturbances at the diaphragm. The filter material may include a mesh and can be supported by a frame, and the frame may be configured to fit underneath the grill.

Apparatus for and method of wind detection

A method, comprising: obtaining one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Audio collection system and method for sound capture, broadcast, analysis, and presentation
11646039 · 2023-05-09 ·

At least a system or a method is provided for remote delivery or collection of a device such as an audio collection device. For example, a device comprising an aperture collection and retrieval pin is provided. An apparatus is provided having an aperture receiver, an aperture drive gear and a drive motor. The drive motor is configured to drive the aperture drive gear to open or close the aperture receiver of the apparatus for retrieving or releasing the device comprising the aperture collection pin.

GENERATING AN AUDIO SIGNAL FROM MULTIPLE MICROPHONES BASED ON UNCORRELATED NOISE DETECTION
20230205485 · 2023-06-29 ·

An audio capture device selects between multiple microphones to generate an output audio signal depending on detected conditions. The audio capture device determines whether one or more microphones are wet or dry and selects one or more audio signals from the one or more microphones depending on their respective conditions. The audio capture device generates a mono audio output signal or a stereo output signal depending on the respective conditions of the one or more microphones.

MEMS TRANSDUCER PACKAGE

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.

MEMS TRANSDUCER PACKAGE

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).