Provided is an electrically heated catalytic converter including at least a conductive substrate and an electrode member that is fixed to the substrate, in which a protective film is formed on a surface of at least a portion of the electrode member. In the electrically heated catalytic converter, at least a portion of the protective film is formed of Al.sub.2O.sub.3, SiO.sub.2, a composite material of Al.sub.2O.sub.3 and SiO.sub.2, or a composite oxide including Al.sub.2O.sub.3, SiO.sub.2, or a composite material of Al.sub.2O.sub.3 and SiO.sub.2 as a major component, the protective film has an amorphous structure or a partially crystalline glass structure having a crystallization rate of 30 vol % or lower with respect to the entire portion of the protective film, and a thickness of the protective film is in a range of 100 nm to 2 μm.

An extendible heating tool includes a body and an extendible heating head releasably engaged with and electrically connected to the body. The body includes a head tip and a first and second electrode disposed in the head tip. The extendible heating head includes a first conductive member electrically connected to the first electrode and a second conductive member electrically connected to the second electrode respectively. The extendible heating head also includes a first conductive extension member telescopically coupled to the first conductive member and a second conductive extension member telescopically coupled to the second conductive member respectively. The first and second conductive extension members are configured to extend from and retract towards the corresponding first and second conductive members.

An aerosol delivery device is provided, and includes a control body serially engaged with a cartridge, the cartridge having an aerosol precursor source housing an aerosol precursor and defining a mouth opening configured to direct an aerosol therethrough to a user. A heater device is operably engaged with the cartridge, wherein the heater device comprises an electrically-conductive carbon element disposed adjacent to a heat-conductive substrate. The heater device is configured to receive the aerosol precursor from the aerosol precursor source onto the heat-conductive substrate, such that the aerosol precursor on the heat-conductive substrate forms the aerosol in response to heat from the electrically-conductive carbon element conducted through the heat-conductive substrate. An associated apparatus and method are also provided.

Disclosed is a heating rod comprising a ceramic heating element, a strip shaped contact sheet, and a housing in which the heating element and the contact sheet are arranged. The contact sheet is coated with nickel.

A radiant heating system includes a housing and a plurality of heating elements. The housing includes a top cover configured to cover and seal an upper surface of the housing and a coolant directing enclosure positioned on an upper interior surface of the top cover. The top cover includes a plurality of openings, an inlet configured to allow a coolant to enter into the housing and an outlet configured to allow the coolant to exit the housing. The plurality of heating elements are configured to be inserted into the plurality of openings of the top cover such that the plurality of heating elements project into the housing and contact a coolant. A diameter of the inlet is greater than a diameter of the outlet.

Described herein is a heater for space equipment that includes a heat pipe. The heater also includes a first layer applied to the heat pipe. The first layer may be made from an electrically non-conductive material. The heater additionally includes a resistance heater printed onto the first layer after the first layer is applied to the heat pipe. The heater includes a second layer adjacent the resistance heater. The resistance heater may be positioned between the first layer and the second layer, and the second layer may be made from an electrically non-conductive material.

A light emitter device contains a heater structure configured to emit light if a predefined current flows through the heater structure. The heater structure is arranged at a heater carrier structure. The light emitter device contains an upper portion of a cavity located vertically between the heater carrier structure and a cover structure. The light emitter device contains a lower portion of the cavity located vertically between the heater carrier structure and at least a portion of a carrier substrate. The heater carrier structure contains a plurality of holes connecting the upper portion of the cavity and the lower portion of the cavity. A pressure within the cavity is less than 100 mbar.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

The invention provides a method and a device for heating an electronic component and an electronic apparatus using the method/device. A heater is disposed at the electronic component. The heating method includes following steps: driving the heater according to a duty ratio by using electrical energy of a power module. If the output voltage of the power module is greater than a first threshold, set the duty ratio as a first ratio. If the output voltage of the power module is less than a second threshold, set the duty ratio as a second ratio. If the output voltage of the power module is between the first threshold and the second threshold, adjust the duty ratio so that the difference between the output voltage of the power module and the second threshold is positively proportional to the duty ratio.