An electric heater includes a substrate (an insulating material capable of forming a conductor pattern on a surface of an insulating substrate), a first plane heating element formed on one surface of the substrate, and a second plane heating element formed on one surface of the substrate to be located outside the first plane heating element. The first plane heating element includes a first pattern portion connecting a start point with an end point located in a first zone, a pair of first electrodes located outside the first zone, and a pair of first connectors connecting the first pattern portion with the first electrodes. The second plane heating element includes a second pattern portion located in a second zone surrounding the first zone and connecting a start point with an end point, and at least some of the first connectors are located in the second zone.

An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane.

An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane.

An exhaust gas heating element comprises a wafer that is substantially cylindrical with an axis and is made of metallic foam. A flexible, electrical insulating sheet covers an edge of the wafer with an overlap on each face of the wafer. A rigid assembly ring, a housing, and two electrodes are also provided. The rigid assembly ring is made from a cylinder trunk, at least a first edge of which is serrated in such a way as to be able to immobilize the wafer and the flexible, electrical insulating sheet in the rigid assembly ring by folding teeth, substantially at 90°.

A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C of the cured product layer is in a range from 5.0×10.sup.6 Pa to 1.0×10.sup.10 Pa.

A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C of the cured product layer is in a range from 5.0×10.sup.6 Pa to 1.0×10.sup.10 Pa.

A garnish includes a heating element, a base member, and a circuit board. The heating element is configured by stacking first and second sheet materials and interposing a heater wire in between. The circuit board includes a power source line and is fixed to a back surface of the base member. The heating element includes a main body portion and an extending portion. The extending portion includes a power source connection portion for connecting the heater wire to the power source line and extends to the back surface of the base member. The main body portion of the heating element is fixed to a laying surface of the base member by fixing the second sheet material to the base member. The heater wire is exposed in the power source connection portion without stacking the second sheet material on the first sheet material.

A garnish includes a heating element, a base member, and a circuit board. The heating element is configured by stacking first and second sheet materials and interposing a heater wire in between. The circuit board includes a power source line and is fixed to a back surface of the base member. The heating element includes a main body portion and an extending portion. The extending portion includes a power source connection portion for connecting the heater wire to the power source line and extends to the back surface of the base member. The main body portion of the heating element is fixed to a laying surface of the base member by fixing the second sheet material to the base member. The heater wire is exposed in the power source connection portion without stacking the second sheet material on the first sheet material.

The present disclosure relates to a refrigerator with improved productivity and quality by using a planar heater. The refrigerator includes a main body having a storage compartment, a door rotatably coupled to the body to open and close the storage compartment, and a planar heater installed on the door to prevent dew condensation from being generated on the door, wherein the planar heater is formed in a film form to be attached to the door.

The present disclosure relates to a refrigerator with improved productivity and quality by using a planar heater. The refrigerator includes a main body having a storage compartment, a door rotatably coupled to the body to open and close the storage compartment, and a planar heater installed on the door to prevent dew condensation from being generated on the door, wherein the planar heater is formed in a film form to be attached to the door.