A device for emanating materials in the environment, preferably by heat evaporation, including: a supply for materials; an emitter of materials, for emitting the materials from the supply to surrounding environment, by application of power from a power supply according to an operation mode; an operation mode adjusting mechanism for adjusting the operation mode of the emitter, by controlling the power delivered to the emitter according to a determined transfer function. The transfer function is modular, so that it can be changed or completely replaced while keeping at least partially the adjusting mechanism in the device.

A retaining body for heating elements, in particular oval and round heating elements, having an outer part assembly and an inner part assembly which is arranged inside the outer part assembly and forms an elastic connection with the outer part assembly under mechanical tension, wherein the outer part assembly and/or the inner part assembly has/have a plurality of receptacles which are arranged distributed in the circumferential direction and in each of which a heating element is arranged, and the outer part assembly and the inner part assembly each comprise a polygon profile with polygon corners and polygon sides which connect the polygon corners. The invention is characterized in that the inner part assembly and the outer part assembly can be rotated relative to one another and are dimensioned in such a way that the polygon profiles are elastically deformed by a relative rotation between the inner part assembly and the outer part assembly in such a way that, in the mounted state, a press fit is formed in the region of the heating elements by the induced mechanical tension.

A method for controlling interfacial thermal resistance is provided. The method includes: providing a metallic thermal conductor and a non-metallic thermal conductor, the metallic thermal conductor and the non-metallic thermal conductor are in direct contact with each other to form an interface; and varying an electric field at the interface to modulate the interfacial thermal resistance at the interface.

A method for controlling interfacial thermal resistance is provided. The method includes: providing a metallic thermal conductor and a non-metallic thermal conductor, the metallic thermal conductor and the non-metallic thermal conductor are in direct contact with each other to form an interface; and varying an electric field at the interface to modulate the interfacial thermal resistance at the interface.

There is provided a technique including: at least one pipe heater configured to heat at least one gas pipe configured to supply a gas to a process chamber in which a substrate is processed; at least one temperature detector configured to detect a temperature of the at least one gas pipe; at least one temperature controller configured to be capable of, based on the temperature detected by the at least one temperature detector, outputting a manipulated variable indicating electric power to be supplied to the at least one pipe heater, and controlling the temperature of the at least one gas pipe to approach at least one desired setpoint; and a host controller configured to be capable of controlling start and stop of heating of the at least one gas pipe performed under the control of the at least one temperature controller.

A heating unit for heating an enclosure includes a base having a central axis, a first end, a second end axially opposite the first end, and a cavity extending axially from the first end. In addition, the heating unit includes a heater disposed in the cavity of the base. Further, the heating unit includes a heat sink mounted to the base. The heat sink includes a plurality of laterally spaced fins and a plurality of laterally spaced channels positioned between the plurality of fins. Still further, the heating unit includes a manifold coupled to the base. A surface of the manifold faces the base and the heat sink. The manifold includes a flow passage and a plurality of orifices in fluid communication with the flow passage. Each orifice has an outlet at the surface of the manifold that is aligned with one of the channels of the first heat sink.

A device having: an article having a flat surface and a lower surface opposed to the flat surface; a cavity formed in the lower surface forming a complete loop surrounding a central portion of the article; a heating element having the same shape as the complete loop in the cavity and positioned to warm a portion of the flat surface adjacent to the heating element when the heating element is activated; a cooling device positioned to cool a portion of the flat surface in the central portion; and a release layer on the flat surface. A device having: an article having an upper surface; a heating element on the upper surface forming a complete loop surrounding a central portion of the article; and an electrically insulating material on the upper surface within the central portion.

A device having: an article having a flat surface and a lower surface opposed to the flat surface; a cavity formed in the lower surface forming a complete loop surrounding a central portion of the article; a heating element having the same shape as the complete loop in the cavity and positioned to warm a portion of the flat surface adjacent to the heating element when the heating element is activated; a cooling device positioned to cool a portion of the flat surface in the central portion; and a release layer on the flat surface. A device having: an article having an upper surface; a heating element on the upper surface forming a complete loop surrounding a central portion of the article; and an electrically insulating material on the upper surface within the central portion.

A heater assembly includes a heating element formed in a mesh having a tubular shape, and configured to generate heat when electricity is supplied, and a plurality of electrodes respectively connected to opposite end portions the heating element in a lengthwise direction, extending in a circumferential direction of the heating element, and configured to supply the electricity to the heating element.

An e-vapor device may include a pre-vapor sector and a heater structure arranged in thermal contact with the pre-vapor sector. The pre-vapor sector is configured to hold and dispense a pre-vapor formulation. The heater structure includes a base wire and a shell layer coating the base wire. The base wire is insulated from the shell layer. The shell layer includes at least one recessed portion between a first unrecessed portion and a second unrecessed portion. The at least one recessed portion is a thinner section of the shell layer that is configured to vaporize the pre-vapor formulation to generate a vapor. As a result of the heater design, the heater structure is stiffer and more robust than other related heaters in the art, thus allowing more options for its implementation.