Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

A cooking apparatus is provided. The cooking apparatus includes heating coils, an input apparatus receiving input of output levels for each of the heating coils, inverters providing driving power to each of the heating coils separately, and a processor controlling the inverters based on the inputted output levels. The processor is configured to predict the power consumption of each of the heating coils based on the inputted output levels, and based on the sum of the predicted power consumption being greater than a predetermined power value, determine a subject heating coil based on the predicted power consumption for each heating coil and history information on power adjustment of the heating coils, and control an inverter corresponding to the subject heating coil such that the subject heating coil operates at a smaller output level than a current output level.

A cooking apparatus is provided. The cooking apparatus includes heating coils, an input apparatus receiving input of output levels for each of the heating coils, inverters providing driving power to each of the heating coils separately, and a processor controlling the inverters based on the inputted output levels. The processor is configured to predict the power consumption of each of the heating coils based on the inputted output levels, and based on the sum of the predicted power consumption being greater than a predetermined power value, determine a subject heating coil based on the predicted power consumption for each heating coil and history information on power adjustment of the heating coils, and control an inverter corresponding to the subject heating coil such that the subject heating coil operates at a smaller output level than a current output level.

An assembly, for example an electrostatic chuck assembly, includes a first member, a second member disposed proximate the first member, a bond layer disposed between the first member and the second member, and at least one optical sensor disposed proximate the bond layer to detect a temperature of the bond layer in a field of view of the at least one optical sensor. The bond layer includes a phosphorescent material and provides a dual function of bonding the second member to the first member and emitting phosphorescent radiation towards the at least one optical sensor. In one form, the first member is an electrostatic chuck member and the second member is a heating plate. The assembly may further include a cooling plate and an additional bond layer disposed between the heating plate and the cooling plate.

Described herein is a technique capable of suppressing adhesion of by-products to a furnace opening portion. A substrate processing apparatus includes: a reaction vessel having an opening at a lower end and accommodating a substrate retainer; a shaft rotatably supporting the substrate retainer; a cap including: a side surface portion having a predetermined gap with an inner surface of the reaction vessel; a cylindrical portion through which the shaft is inserted; an upper plate portion of an annular shape; and a flange connected to a lower end of the side surface portion; and a cap cover connected to the shaft above the upper end of the cylindrical portion. A purge gas from thereunder flows sequentially to a space between the shaft and the cylindrical portion, a space between the upper plate portion and the cap cover and a space between the side surface portion and the cap cover.

An electric heating pot including a body unit and a heating unit configured to provide heat to the body unit. The body unit includes an accommodation space configured to accommodate liquid, the heating unit includes a housing formed such that electrolyzed water is disposed therein, and an electrode portion that is disposed in the housing, formed such that at least one region thereof is in contact with the electrolyzed water in the housing, and includes a plurality of electrodes.

A glass-ceramic cooktop is provided that is made of glass-ceramic material with a flat upper side and an underside. The glass-ceramic material has transmittance values of greater than 0.1% in the visible light range in the total wavelength region greater than 420 nm, a light transmittance in the visible range of 0.8-2.5%, and a transmittance of 0-85% in the infrared at 1600 nm, and wherein the glass-ceramic material has high quartz mixed crystals as the prevalent crystal phase. The underside is flat, unstructured, and coplanar with the upper side.

A heating appliance includes a translucent cooktop and a burner in communication with the cooktop. The burner is operable between deactive and active states. The upper surface of the cooktop defines a cooldown state after the burner is moved from the active to the deactive state. A light module includes a light source and is in an illuminated state when the burner is in the active state and when the cooktop is in the cooldown state. A light guide extends from the light module and around a portion of the burner. The light guide is positioned such that the light source directs light through the light guide. The outer surface of the light guide includes a formed surface that directs light upward and through the cooktop, wherein the light guide is visible through the cooktop when the light module is in the illuminated state.

The invention relates to a special electrode arrangement for the targeted ohmic heating of different products, media or structures that are electrically conductive or contain electrically conductive constituents and have an inorganic or organic basis, including products of plant or animal origin, consisting of at least one electrode group comprising a plurality of individual electrodes. According to the invention, the individual electrodes are arranged at a distance apart from one another in an insulating carrier and, with the exception of an electrode surface region, are insulated from the product to be treated or the structure to be treated.