Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

In an embodiment, an apparatus includes a radio frequency (RF) generator that is to generate a RF signal, first and second electrodes, and an impedance match module in series between the RF generator and the first electrode. The RF generator detects reflected power from the RF signal applied to a load electrically coupled between the first and second electrodes to change a temperature of the load, the RF signal to be applied to the load until the reflected power reaches a particular value.