The organic EL display device includes a third organic insulating film pattern portion, which includes a groove on an upper surface thereof, between a display region and at least part of an edge portion of a TFT substrate. A first inorganic layer and a second inorganic layer of a sealing film cover the third organic insulating film pattern portion and at least part of the edge portion in a plan view, and are split apart in the groove.

The vapor deposition source includes a containing unit configured to contain vapor deposition particles and a plurality of nozzles aligned in a line form along an X axis direction, and in the vapor deposition source, the plurality of nozzles at an end portion in the X axis direction of the containing unit protrude in an oblique direction toward the end portion in the X axis direction, arrangement density of nozzles provided at the end portion in the X axis direction of the containing unit is higher than arrangement density of nozzles provided at a center portion of the containing unit, and a line connecting upper end faces of the nozzles adjacent to each other at the end portion in the X axis direction of the containing unit is linearly provided.

Provided is a manufacturing method of a display device in which, after a layered body including a resin layer, a TFT layer, and a light emitting element layer is formed on a substrate configured to form a plurality of display devices, the resin layer is irradiated with laser from a back face of the substrate and the substrate is peeled from the layered body using a laser peeling device. The manufacturing method of a display device includes acquiring optical information of the substrate that is peeled off, detecting each acquisition result of the plurality of display devices from each assigned position of the plurality of display devices relative to the substrate, and performing predetermined processing on the display device in a case that the acquisition result of the display device exceeds a threshold value.

A manufacturing method of a mask sheet includes a film formation step for forming a metal layer provided with a plurality of openings on a mask substrate, and a shaping step for shaping the metal layer using pulse electrolysis.

The present invention relates to novel formulations comprising an organic semiconductor (OSC) and one or more organic solvents. The formulation comprises a viscosity at 25 C. of less than 15 mPas and the boiling point of the solvent is at most 400 C. Furthermore, the present invention describes the use of these formulations as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel formulations, and to OE devices, OLED devices and OPV cells prepared from such methods and formulations.

The present invention relates to novel formulations comprising an organic semiconductor (OSC) and one or more organic solvents. The formulation comprises a viscosity at 25 C. of less than 15 mPas and the boiling point of the solvent is at most 400 C. Furthermore, the present invention describes the use of these formulations as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel formulations, and to OE devices, OLED devices and OPV cells prepared from such methods and formulations.

An organic electroluminescent device includes a substrate, driving circuit layer, inorganic protective layer, organic flattening layer, organic electroluminescent element layer, and TFE structure. The TFE structure includes a first inorganic barrier layer, organic barrier layer, and second inorganic barrier layer. The organic flattening layer is formed in a region where the inorganic protective layer is formed, organic electroluminescent elements are located in a region where the organic flattening layer is formed, and an outer perimeter of the TFE structure crosses lead wires and is present between an outer perimeter of the organic flattening layer and an outer perimeter of the inorganic protective layer. In a region where the inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the lead wires, a tapering angle of a side surface of a cross-section of the first inorganic barrier layer is smaller than 90 degrees.

An encapsulation film covering a light emitting element includes: a first inorganic layer covering the light emitting element; an organic layer formed on the first inorganic layer; a second inorganic layer formed on the organic layer; and a third inorganic layer formed on the second inorganic layer. The peripheral end face of the second inorganic layer is aligned with the peripheral end face of the organic layer. The third inorganic layer covers the peripheral end face of the first inorganic layer or the peripheral end face of the second inorganic layer.

A color conversion element and a display device including the same are provided. The color conversion element includes: a base substrate in which a first region and a second region are defined; a color conversion layer on the base substrate, in the first region, and including color conversion particles configured to convert a wavelength of incident light; and a color light transmitting layer on the base substrate and in the second region; wherein each of the color conversion particles includes a compound represented by Formula 1 (AmBnXl - - - (1)), where, in Formula 1, A is Cs, Rb, or an alloy thereof; B is at least one of Cu, Sb, Ge, Sn, and Bi, or an alloy thereof; m, n, and I are each an integer of 1 to 9; and X is at least one of F, Cl, Br, and I, or a mixture thereof.

A light emitting device, a method of manufacturing the same, and a display device including the same are disclosed. The light emitting device including a first electrode and a second electrode facing each other, an emission layer disposed between the first electrode and the second electrode, the emission layer including quantum dots, and a charge auxiliary layer disposed between the emission layer and the second electrode, wherein the emission layer includes a first surface facing the charge auxiliary layer and an opposite second surface, the quantum dots include a first organic ligand on a surface of the quantum dots, in the emission layer, an amount of the first organic ligand in a portion adjacent to the first surface is larger than an amount of the first organic ligand in a portion adjacent to the second surface.