H05B33/10

Method of manufacturing organic EL element

A method of manufacturing an organic EL element (1) includes: a step of forming a first electrode layer (5), an organic functional layer (7), and a second electrode layer (9) on a substrate (3), a step of detecting a defective portion after forming the second electrode layer (9), a step of removing the second electrode layer (9) in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer (9) side when the defective portion has been detected, and a step of forming a sealing layer (11) after removing the second electrode layer 9 in the defective portion.

Method of manufacturing organic EL element

A method of manufacturing an organic EL element (1) includes: a step of forming a first electrode layer (5), an organic functional layer (7), and a second electrode layer (9) on a substrate (3), a step of detecting a defective portion after forming the second electrode layer (9), a step of removing the second electrode layer (9) in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer (9) side when the defective portion has been detected, and a step of forming a sealing layer (11) after removing the second electrode layer 9 in the defective portion.

Fresh lamp, mobile terminal, and system and method for determining product information

A fresh lamp, which includes: an LED module, and a driving power supply connected to the LED module which includes a bright-dark control circuit; wherein the bright-dark control circuit includes a programmable circuit, the programmable circuit being configured to program product information into binary codes; wherein the bright-dark control circuit is configured to switch on the driving power supply according to one of the numbers 1 and 0 in the binary codes and switch off the driving power supply according to the other one of the numbers 1 and 0 in the binary codes so that the LED module emits light signals alternating with brightness and darkness to form light emission information corresponding to the product information.

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE
20200075888 · 2020-03-05 ·

A sealing member (200) is a sheet-like member to seal a light-emitting unit of a light-emitting device. The sealing member (200) is cut into a shape including a corner (220) having a central angle that is larger than 180 degrees when the light-emitting unit of the light-emitting device is sealed. When the sealing member (200) is cut, irregularities occur in the thickness direction in a region (222: first region) having a predetermined width w from an edge of the corner (220). When the irregularities occur, sealability of the sealing member (200) is deteriorated. Here, when a curvature radius of the corner ((220)) is equal to or greater than the above-mentioned width w, occurrence of the above-mentioned irregularities is inhibited.

ELECTROLUMINESCENT ASSEMBLY
20200077488 · 2020-03-05 · ·

An electroluminescent assembly comprising at least one male electroluminescent device and a female electroluminescent device; the male electroluminescent device comprising: a first male connection zone, wherein a first male connector is in contact with the first conductive layer of the male electroluminescent device, and a second male connection zone, wherein a second male connector is in contact with the second conductive layer of the male electroluminescent device the first male connector being connected to the first conductive layer of the female electroluminescent device, and the second male connector being connected to the second conductive layer of the female electroluminescent device.

ELECTROLUMINESCENT ASSEMBLY
20200077488 · 2020-03-05 · ·

An electroluminescent assembly comprising at least one male electroluminescent device and a female electroluminescent device; the male electroluminescent device comprising: a first male connection zone, wherein a first male connector is in contact with the first conductive layer of the male electroluminescent device, and a second male connection zone, wherein a second male connector is in contact with the second conductive layer of the male electroluminescent device the first male connector being connected to the first conductive layer of the female electroluminescent device, and the second male connector being connected to the second conductive layer of the female electroluminescent device.

Method and apparatus for producing flexible OLED device

According to a flexible OILED device production method of the present disclosure, after an intermediate region. (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with stage (210). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources such that the irradiation intensity of the laser light for at least part of the interface between the intermediate region (30i) and the glass base (10) is lower than the irradiation intensity of the laser light for the interface between the flexible substrate region (30d) and the class base (10).

Method for producing organic electroluminescent display device

An organic EL display device (100) including a plurality of pixels includes an element substrate (1) including a substrate, and a plurality of organic EL elements supported by the substrate and respectively located in the plurality of pixels; and a thin film encapsulation structure (10) covering the plurality of pixels. The thin film encapsulation structure includes a first inorganic barrier layer (12), an organic barrier layer (14) in contact with a top surface of the first inorganic barrier layer (12), the organic barrier layer (14) including a plurality of solid portions distributed discretely, and a second inorganic barrier layer (16) in contact with the top surface of the first inorganic barrier layer (12) and top surfaces of the plurality of solid portions of the organic barrier layer (14). The organic barrier layer (14) is black.

MANUFACTURING METHOD FOR ORGANIC DEVICE

A method for manufacturing an organic device (1) includes a forming step of forming a plurality of organic device parts (10) at predetermined intervals on a support substrate (3) which extends in one direction, a bonding step of bonding a sealing member (11) respective the organic device parts (10), and a cutting step of separating the organic device parts (10) into pieces, and in the cutting step, while an area of the one main surface (3a) of the support substrate (3) to which the sealing member (11) is not bonded and the sealing member (11) are supported by a support (100) in contact with the area and the sealing member (11), a cutting blade B is made to enter from the side of the other main surface (3b) of the support substrate (3).

DISPLAY DEVICE AND MANUFACTURING METHOD FOR DISPLAY DEVICE

A display device including a resin layer, and a TFT layer being an upper layer with respect to the resin layer, wherein a bending section is provided on a peripheral edge, includes a terminal wiring line that is connected to a terminal in the TFT layer and passes through the bending section, and the terminal wiring line includes a first wiring line and a second wiring line that are positioned on both sides of the bending section, a third wiring line that passes through the bending section and is electrically connected with each of the first wiring line and the second wiring line, and a fourth wiring line that is formed in a layer different from that of the third wiring line and is electrically connected with each of the first wiring line and the second wiring line.