Patent classifications
H05B33/10
METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE
A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20 C. to a melting point of a parent resin of the flexible base material.
Aromatic amine derivative, material for organic electroluminescent element, and organic electroluminescent element
An aromatic amine derivative is represented by the following formula (1). In the formula (1), R.sub.2 to R.sub.5, R.sub.7 to R.sub.9 and R.sub.10 are each independently a hydrogen atom or a substituent. R.sub.1 and R.sub.6 in the formula (1) are each represented by the following formula (2), in which L.sub.1 to L.sub.3 are each independently, for instance, a single bond. Ar.sub.1 in the formula (2) is a monovalent residue derived from a ring structure of the following formula (4), in which X is an oxygen atom or a sulfur atom and at least one of R.sub.11 to R.sub.18 is a substituted aryl group. Ar.sub.1 in the formula (1) is, for instance, an aryl group or a monovalent residue derived from the ring structure of the formula (4). ##STR00001##
Aromatic amine derivative, material for organic electroluminescent element, and organic electroluminescent element
An aromatic amine derivative is represented by the following formula (1). In the formula (1), R.sub.2 to R.sub.5, R.sub.7 to R.sub.9 and R.sub.10 are each independently a hydrogen atom or a substituent. R.sub.1 and R.sub.6 in the formula (1) are each represented by the following formula (2), in which L.sub.1 to L.sub.3 are each independently, for instance, a single bond. Ar.sub.1 in the formula (2) is a monovalent residue derived from a ring structure of the following formula (4), in which X is an oxygen atom or a sulfur atom and at least one of R.sub.11 to R.sub.18 is a substituted aryl group. Ar.sub.1 in the formula (1) is, for instance, an aryl group or a monovalent residue derived from the ring structure of the formula (4). ##STR00001##
Display device, semiconductor device, and method of manufacturing display device
A display device according to the present disclosure includes: a transistor section (100) that includes a gate insulating film (130), a semiconductor layer (140), and a gate electrode layer (120), the semiconductor layer being laminated on the gate insulating film, the gate electrode film being laminated on an opposite side to the semiconductor layer of the gate insulating film; a first capacitor section (200) that includes a first metal film (210) and a second metal film (220), the first metal film being disposed at a same level as wiring layers (161, 162) that are electrically connected to the semiconductor layer and is disposed over the transistor section, the second metal film being disposed over the first metal film with a first interlayer insulating film (152) in between; and a display element that is configured to be controlled by the transistor section.
Display device, semiconductor device, and method of manufacturing display device
A display device according to the present disclosure includes: a transistor section (100) that includes a gate insulating film (130), a semiconductor layer (140), and a gate electrode layer (120), the semiconductor layer being laminated on the gate insulating film, the gate electrode film being laminated on an opposite side to the semiconductor layer of the gate insulating film; a first capacitor section (200) that includes a first metal film (210) and a second metal film (220), the first metal film being disposed at a same level as wiring layers (161, 162) that are electrically connected to the semiconductor layer and is disposed over the transistor section, the second metal film being disposed over the first metal film with a first interlayer insulating film (152) in between; and a display element that is configured to be controlled by the transistor section.
METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE AND ORGANIC LIGHT EMITTING DEVICE
A first light emitting unit includes a hole injection layer, a first hole transport layer, and a first light emitting layer. A second light emitting unit includes a hole injection layer, a second hole transport layer, a third hole transport layer, a third hole transport layer, and a second light emitting layer. The second hole transport layer is formed on the hole injection layer and includes a first hole transporting material. The third hole transport layer is formed on the second hole transport layer and includes a second hole transporting material. A fourth hole transport layer is formed on the third hole transport layer and includes the same material as the second hole transport layer, that is, the second hole transporting material. The third hole transport layer is formed by using a coating method, and the fourth hole transport layer is formed by a vapor deposition method.
METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE AND ORGANIC LIGHT EMITTING DEVICE
A first light emitting unit includes a hole injection layer, a first hole transport layer, and a first light emitting layer. A second light emitting unit includes a hole injection layer, a second hole transport layer, a third hole transport layer, a third hole transport layer, and a second light emitting layer. The second hole transport layer is formed on the hole injection layer and includes a first hole transporting material. The third hole transport layer is formed on the second hole transport layer and includes a second hole transporting material. A fourth hole transport layer is formed on the third hole transport layer and includes the same material as the second hole transport layer, that is, the second hole transporting material. The third hole transport layer is formed by using a coating method, and the fourth hole transport layer is formed by a vapor deposition method.
Display module and method for coating the same
The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.
Display module and method for coating the same
The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.
Film-forming ink, film formation method, device with film, and electronic apparatus
To provide a film-forming ink and a film formation method, capable of making the dimensional accuracy of a film to be formed excellent by increasing the apparent liquid droplet amount of a film-forming ink to be supplied as a liquid droplet into an opening part included in a partition wall, and also to provide a device with a film and an electronic apparatus, each of which has a film formed using the film formation method. A film-forming ink of the invention includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed, wherein the liquid medium contains a first component which has a boiling point at an atmospheric pressure of 200 C. or higher and a second component which has a boiling point at an atmospheric pressure lower than the first component.