To provide a film-forming ink and a film formation method, capable of making the dimensional accuracy of a film to be formed excellent by increasing the apparent liquid droplet amount of a film-forming ink to be supplied as a liquid droplet into an opening part included in a partition wall, and also to provide a device with a film and an electronic apparatus, each of which has a film formed using the film formation method. A film-forming ink of the invention includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed, wherein the liquid medium contains a first component which has a boiling point at an atmospheric pressure of 200 C. or higher and a second component which has a boiling point at an atmospheric pressure lower than the first component.

An organic EL display device includes, as an organic layer stopper defining edges of an organic layer, a frame-shaped bank surrounding a display region. An upper face of the bank includes recessed portions and protrusions including a plurality of protrusions, and upper faces of the protrusions includes planar portions.

The present invention relates to an organic electronic material containing at least an ionic compound represented by general formula (1) shown below and a compound having a charge transport unit. The present invention can provide an organic electronic material that is capable of forming an organic electronic element having a low drive voltage and excellent emission efficiency and lifespan characteristics. In general formula (1), ArF represents a fluoroaryl group or a fluoroheteroaryl group, each of R.sup.a and R.sup.b independently represents a hydrogen atom (H), an alkyl group, a benzyl group, an aryl group or a heteroaryl group, and A represents an anion.

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A wiring correcting device is configured for irradiation of a beam of CVD-addressing laser light oscillated by a CVD-addressing laser oscillator to cause a photo-degradation of a CVD-addressing raw material gas to develop on a laser-irradiated surface of a correction-addressing substrate, thereby forming a length of correction-addressing metal wiring on the laser-irradiated surface, and provided with a modification-addressing laser oscillator, which is configured to oscillate a beam of modification-addressing laser light different in wavelength from the beam of CVD-addressing laser light, and adapted for melting agglomerates of a correction-addressing metal to be solidified.

Provided is a lighting device that emits light of a color that approximates the color of the surface of an object or the like. Disclosed is a method for manufacturing a lighting device, including the steps of: spectroscopically measuring a spectrum that constitutes a color of a measurement target; and adjusting a color of a light source such that an emission spectrum approximates the spectrum that constitutes the color of the measurement target.

Provided is a lighting device that emits light of a color that approximates the color of the surface of an object or the like. Disclosed is a method for manufacturing a lighting device, including the steps of: spectroscopically measuring a spectrum that constitutes a color of a measurement target; and adjusting a color of a light source such that an emission spectrum approximates the spectrum that constitutes the color of the measurement target.

A portion of a resin film is precisely cut out when the resin film is peeled off. A rear surface of a glass substrate on which a protrusion is formed is irradiated with a laser beam to peel a resin film from the glass substrate. Then, the protrusion and the resin film formed on the protrusion are left on the glass substrate.

The invention is a method for manufacturing an organic electronic device sealing body, adhesively integrating an organic electronic device with a sheet-like sealant made of a modified hydrocarbon-based soft resin having an alkoxysilyl group, the method comprising steps of: step [1]: laminating the organic electronic device and the sheet-like sealant to obtain a laminate; step [2]: putting the resulting laminate into a resin bag, degassing the bag, and then sealing the bag containing the laminate; and step [3]: placing the sealed bag under a pressure of 0.1 MPa or higher to adhesively integrate the laminate. One aspect of the invention provides a method for manufacturing an organic electronic device sealing body which allows industrially-advantageous sealing of the organic electronic device including organic functional elements such as an organic EL element and an organic semiconductor element.

A transparent thin film display element (100) with a display region(101), and a transition region (105) having a first edge (106) bordering the display region and a second edge (107) opposite to the first edge, the transparent display element having a layer stack (103) comprises:a first conductor layer (110); a second conductor layer (120); andan emissive layer (130) superposed between the first and the second conductor layers and configured to emit light upon electrical current flowing through the emissive layer between the first and the second conductor layers. At least one layer (120) of a group comprising the first and the second conductor layers and the emissive layer has, in the transition region (105), a first coverage at the first edge (106), a second coverage lower than the first coverage at the second edge (107), and an intermediate coverage lying between the first and the second coverage.

In a method for producing a vapor deposition mask including a resin mask 20 including resin mask openings 25 corresponding to a pattern to be produced by vapor deposition, and a metal mask 10 including a metal mask opening 15, the metal mask being stacked on one surface of the resin mask, when the plurality of resin mask openings 25 are formed, as to any one resin mask opening 25a of the plurality of resin mask openings 25, the resin mask opening 25 is formed such that in a thicknesswise cross section of the resin mask, an acute angle (1) formed by one inner wall surface forming the one resin mask opening and the other surface of the resin mask is different from an acute angle (2) formed by the other inner wall surface forming the one resin mask opening and the other surface of the resin mask.