In a manufacturing method for an organic EL display device according to an embodiment, a support substrate is mounted on a surface of a vapor deposition mask (S3) which surface faces a vapor deposition source and has been subjected to a modification treatment (S2), and a desired organic material is evaporated to the vapor deposition mask, so as to deposit an organic layer formed of multiple layers in a desired area on the support substrate (S4), and further a second electrode is formed on the organic layer (S8). An exposed surface of the vapor deposition mask or an exposed surface of the organic layer formed on the vapor deposition mask is modified at at least one timing among: before depositing the organic layer formed of the multiple layers; before or after depositing each organic layer of the multiple layers forming the organic layer; and before forming the second electrode.

Provided are a compound for an organic optoelectronic device represented by Chemical Formula 1, an organic light emitting diode including the same, and a display device including the organic light emitting diode. The structure of Chemical Formula 1 is shown in the specification. The compound for an organic optoelectronic device provides an organic light emitting diode having life-span characteristics due to excellent electrochemical and thermal stability, and having high luminous efficiency at a low driving voltage.

Provided are a compound for an organic optoelectronic device represented by Chemical Formula 1, an organic light emitting diode including the same, and a display device including the organic light emitting diode. The structure of Chemical Formula 1 is shown in the specification. The compound for an organic optoelectronic device provides an organic light emitting diode having life-span characteristics due to excellent electrochemical and thermal stability, and having high luminous efficiency at a low driving voltage.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

A display device includes a display and at least one light source. The display displays image. The at least one light source emits light to the display. The at least one light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.

A display device includes a display and at least one light source. The display displays image. The at least one light source emits light to the display. The at least one light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.

An ink for forming a functional layer, which is used when any thin film layer among functional layers consisting of a plurality of thin film layers is formed, includes a functional layer forming material and a solvent for dissolving the functional layer forming material, and in which the number of particles of 0.5 m or more is 7 or less in 10 ml of the ink for forming a functional layer.

An ink for forming a functional layer, which is used when any thin film layer among functional layers consisting of a plurality of thin film layers is formed, includes a functional layer forming material and a solvent for dissolving the functional layer forming material, and in which the number of particles of 0.5 m or more is 7 or less in 10 ml of the ink for forming a functional layer.

A film member having a concave-convex structure is composed of a base member; a gas barrier layer formed on the base member; and a concave-convex structure layer formed on a surface of the gas barrier layer, wherein the surface of the gas barrier layer is formed of an inorganic material which is same as a material of the concave-convex structure layer, and the concave-convex structure layer is obtained from a precursor solution applied on the gas barrier layer. The film member having the concave-convex structure has an excellent adhesion property between the concave-convex structure layer and the gas barrier layer, and a high barrier property.