A semiconductor device which has favorable electrical characteristics is provided. A method for manufacturing a semiconductor device with high productivity is provided. A method for manufacturing a semiconductor device with a high yield is provided. A method for manufacturing a semiconductor device includes a first step of forming a first insulating layer containing silicon and nitrogen, a second step of adding oxygen in a vicinity of a surface of the first insulating layer, a third step of forming a semiconductor layer containing a metal oxide over and in contact with the first insulating layer, a fourth step of forming a second insulating layer containing oxygen over and in contact with the semiconductor layer, a fifth step of performing plasma treatment in an atmosphere containing oxygen at a first temperature, a sixth step of performing plasma treatment in an atmosphere containing oxygen at a second temperature lower than the first temperature, and a seventh step of forming a third insulating layer containing silicon and nitrogen over the second insulating layer.

A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.

In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

Disclosed is a laminate which includes one or more soft layers and an electronic device enclosed by the one or more soft layers, wherein the one or more soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m.sup.2.Math.24 h).Math.100 μm] or less.

A display device of the present disclosure includes a plurality of recess portions provided on a pixel formation surface, and a pixel arranged in each of the plurality of recess portions, in which a light-emitting unit of the pixel is formed on a side wall and a bottom surface of each of the plurality of recess portions. A manufacturing method of a display device of the present disclosure is a manufacturing method of a display device having the above-described configuration. Furthermore, an electronic device of the present disclosure is an electronic device including a display device having the above-described configuration.

A display device of the present disclosure includes a pixel region including a pixel including a light emitting unit arranged on a substrate, and, in the pixel region, an anode electrode of the light emitting unit is provided with a region including a pixel inclined with respect to a substrate surface. Then, an electrode surface of the anode electrode has an inclination angle according to a surface shape of a base insulating layer. An electronic device of the present disclosure includes the display device having the configuration described above.

A display device comprises: a display region having a plurality of pixels; and a frame region, the display region including: a thin-film transistor layer; a light-emitting-element layer provided above the thin-film transistor layer; and a sealing layer provided above the light-emitting-element layer, the light-emitting-element layer including: a first electrode; a second electrode; a light-emitting layer provided between the first electrode and the second electrode; and an electron-transport layer provided between the light-emitting layer and the second electrode, and the electron-transport layer containing: nanoparticles of metal oxide; and a binding resin.

A display device includes: a display region, a frame region, a thin-film transistor layer, and a light emitter layer including a plurality of light emitters each having a first electrode, a light-emitting layer, and a second electrode. The plurality of light emitters emits mutually different colors of light. The second electrode is shared among the plurality of light emitters and contains a metal nanowire. The frame region includes a bank having a frame shape surrounding the display region and defining an end of the second electrode. A conductive film is disposed closer to the display region than the bank is, the conductive film electrically connecting together the terminal section and the second electrode. The conductive film includes a contact portion being in contact with the metal nanowire. The contact portion has a plurality of asperities disposed on a contact surface being in contact with the metal nanowire.

A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.

A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.