H05B33/10

METHOD AND APPARATUS FOR PRODUCING FLEXIBLE OLED DEVICE
20210167338 · 2021-06-03 ·

According to a flexible OLED device production method of the present disclosure, a multilayer stack is provided which includes a glass base, a functional layer region including a TFT layer and an OLED layer, and a synthetic resin film provided between the glass base and the functional layer region and bound to the glass base. In a dry gas atmosphere whose dew point is not more than −50° C., the multilayer stack is separated into a first portion and a second portion, and a surface of the synthetic resin film is exposed to the dry gas atmosphere, the first portion including the functional layer region and the synthetic resin film, the second portion including the glass base. The first portion is transported from the dry gas atmosphere to a reduced-pressure atmosphere, and a protection layer is formed on the surface of the synthetic resin film in the reduced-pressure atmosphere.

METAL PLATE FOR PRODUCING VAPOR DEPOSITION MASKS, PRODUCTION METHOD FOR METAL PLATES, VAPOR DEPOSITION MASK, PRODUCTION METHOD FOR VAPOR DEPOSITION MASK, AND VAPOR DEPOSITION MASK DEVICE COMPRISING VAPOR DEPOSITION MASK

A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 μm. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 μm.sup.2 to 50 μm.sup.2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.

FILM-FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND PLASMA ATOMIC LAYER DEPOSITION APPARATUS

In a film-forming technology using charged particles, a disturbance in film thickness distribution caused by leakage magnetic field is suppressed. A film-forming method embodies a technological idea of switching generation and stop of a magnetic field during a film-forming operation so as to stop the generation of the magnetic field during a period when plasma is generated and generate the magnetic field during a period when plasma is not generated.

DISPLAY DEVICE AND PRODUCTION METHOD THEREFOR

A display device includes a TFT substrate including a flattening layer on a surface, a sealing film including a resin film that is an ink-jet resin film, and a first bank that surrounds the flattening layer, is covered with the resin film on an inner side, and has a frame shape. The flattening layer includes, on an entire periphery of a circumferential end portion thereof, a recessed and protruding portion provided with recesses and protrusions having sizes different on a first side and a second side in a plan view.

ORGANIC EL LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
20210151705 · 2021-05-20 ·

An organic EL light-emitting element is provided in which, by means of an organic material that is oligomeric, an organic layer coated film 25 is formed in a high-definition pixel pattern in a 100-2500 μm.sup.2 area; a manufacturing method of said organic EL light-emitting element is also provided. The coated film 25 is formed by dropwise injection of a liquid composition containing an organic material oligomer in openings of insulation banks that are formed at a height of 0.5-1 μm.

Organic EL display apparatus and method of manufacturing organic EL display apparatus
11024677 · 2021-06-01 · ·

An organic-EL display apparatus comprises: a substrate comprising a first electrode; an organic layer formed of organic materials so as to form a plurality of pixels arrayed in a matrix form, the organic material being vapor-deposited on the first electrode; and a second electrode formed on the organic layer. Each of the plurality of pixels comprises at least three sub-pixels having substantially rectangular shapes; a first sub-pixel and a second sub-pixel among the at least three sub-pixels are arranged in parallel with each other such that a long side of the first sub-pixel and a long side of the second sub-pixel are substantially parallel with each other; and a third sub-pixel among the at least three sub-pixels is formed such that a long side of the third sub-pixel is substantially parallel with a short side of the first sub-pixel and a short side of the second sub-pixel. In the first sub-pixel and the second sub-pixel, a variation in a thickness of the organic layer through a long-side direction is larger than a variation in the thickness of the organic layer through a short-side direction; and in the third sub-pixel, a variation in a thickness of the organic layer through a short-side direction is larger than a variation in the thickness of the organic layer through a long-side direction.

Display device and electronic device with microlens array and light emitting element substrates bonded by adhesive layer

There is provided a display device including: a first substrate that is a silicon substrate and on which a plurality of light-emitting elements is formed; a second substrate including, on a surface, a color filter layer including a plurality of color filters arrayed and a microlens layer including a plurality of microlenses arrayed that are layered in this order, the microlens layer being arranged to face the plurality of light-emitting elements with respect to the first substrate; and an adhesive layer that fills a gap between the first substrate and the second substrate for bonding the first substrate and the second substrate together.

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT COMPRISING CURED FILM, ORGANIC EL DISPLAY DEVICE COMPRISING CURED FILM, METHOD FOR PRODUCING CURED FILM, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE

A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E.sub.2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E.sub.1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

VAPOR DEPOSITION MASK, PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE
20210167337 · 2021-06-03 ·

A vapor deposition mask is provided with: a resin film, which has at least one of first to third opening patterns in which first to third openings, for forming first to third subpixels that configure one pixel of a display panel, are disposed with a fixed periodicity; and a metal support layer, which is bonded to the resin film and has an opening pattern for fourth openings that are formed so as to be able to encompass all of the first to third openings of the resin film. In regions of the resin film exposed by the fourth openings of the metal support layer, one or two of the first to third openings of the resin film are formed.

VAPOR DEPOSITION MASK, PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE
20210167337 · 2021-06-03 ·

A vapor deposition mask is provided with: a resin film, which has at least one of first to third opening patterns in which first to third openings, for forming first to third subpixels that configure one pixel of a display panel, are disposed with a fixed periodicity; and a metal support layer, which is bonded to the resin film and has an opening pattern for fourth openings that are formed so as to be able to encompass all of the first to third openings of the resin film. In regions of the resin film exposed by the fourth openings of the metal support layer, one or two of the first to third openings of the resin film are formed.