Patent classifications
H05B33/10
Compounds and organic electronic devices
The present invention relates to certain fluorenes, to the use of the compounds in an electronic device, and to an electronic device comprising at least one of these compounds. The present invention furthermore relates to a process for the preparation of the compounds and to a formulation and composition comprising one or more of the compounds.
Compounds and organic electronic devices
The present invention relates to certain fluorenes, to the use of the compounds in an electronic device, and to an electronic device comprising at least one of these compounds. The present invention furthermore relates to a process for the preparation of the compounds and to a formulation and composition comprising one or more of the compounds.
ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES
Organometallic compounds comprising an imidazole carbene ligand having a N-containing ring fused to the imidazole ring are provided. In particular, the N-containing ring fused to the imidazole ring may contain one nitrogen atom or more than one nitrogen atom. These compounds may demonstrate high photoluminescent (PL) efficiency, Gaussian emission spectra, and/or short excited state lifetimes. These materials may be especially useful as blue phosphorescent emitters.
ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES
Organometallic compounds comprising an imidazole carbene ligand having a N-containing ring fused to the imidazole ring are provided. In particular, the N-containing ring fused to the imidazole ring may contain one nitrogen atom or more than one nitrogen atom. These compounds may demonstrate high photoluminescent (PL) efficiency, Gaussian emission spectra, and/or short excited state lifetimes. These materials may be especially useful as blue phosphorescent emitters.
Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs
A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.
Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs
A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.
Method of manufacturing image display device
An image display device is manufactured by: applying a liquid photo-curable resin composition having a total value of cure shrinkage ratios based on pre-curing and complete curing of 3% or more to a surface of the light-transmitting cover member or a surface of the image display member with a thickness greater than that of the light-shielding layer to cancel the step between the light-shielding layer and the light-shielding layer forming surface of the light-transmitting cover member; pre-curing the photo-curable resin composition with the irradiation of ultraviolet rays to form a pre-cured resin layer; bonding the light-transmitting cover member to the image display member such that the pre-cured resin layer is placed inside; and subjecting the pre-cured resin layer to the irradiation of ultraviolet rays to achieve the complete curing thereof. The pre-curing is conducted to obtain a cure shrinkage ratio less than 3% in the complete curing thereof.
Method of manufacturing image display device
An image display device is manufactured by: applying a liquid photo-curable resin composition having a total value of cure shrinkage ratios based on pre-curing and complete curing of 3% or more to a surface of the light-transmitting cover member or a surface of the image display member with a thickness greater than that of the light-shielding layer to cancel the step between the light-shielding layer and the light-shielding layer forming surface of the light-transmitting cover member; pre-curing the photo-curable resin composition with the irradiation of ultraviolet rays to form a pre-cured resin layer; bonding the light-transmitting cover member to the image display member such that the pre-cured resin layer is placed inside; and subjecting the pre-cured resin layer to the irradiation of ultraviolet rays to achieve the complete curing thereof. The pre-curing is conducted to obtain a cure shrinkage ratio less than 3% in the complete curing thereof.
LIGHT SOURCE
A light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.
LIGHT SOURCE
A light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.