Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

Electroluminescent laminar luminaire comprising a laminar substrate (2), at least one flexible electroluminescent lamp (1) printed on the substrate (2), and electric power supply means of the EL lamp (1) housed together inside an encapsulating casing (8). The latter contains at least one hot-melt adhesive (HMA), preferably EVA, and accurately matches the external shape of the EL lamp (1) and the relief, and the electric power supply means that protrude from the substrate (2), covering them fully without leaving any gaps, constituting a closed, flexible, compact and fluid-tight luminaire (100).

Electroluminescent laminar luminaire comprising a laminar substrate (2), at least one flexible electroluminescent lamp (1) printed on the substrate (2), and electric power supply means of the EL lamp (1) housed together inside an encapsulating casing (8). The latter contains at least one hot-melt adhesive (HMA), preferably EVA, and accurately matches the external shape of the EL lamp (1) and the relief, and the electric power supply means that protrude from the substrate (2), covering them fully without leaving any gaps, constituting a closed, flexible, compact and fluid-tight luminaire (100).

A method for manufacturing a display device includes a pixel circuit formed on a substrate, wherein a manufacturing process of the pixel circuit includes a patterning step of a metal film performed in the following procedures (a) to (e): (a) forming the metal film on the substrate; (b) forming a first resist pattern on the metal film by a photolithographic method; (c) etching the metal film with the first resist pattern to form a first metal pattern; (d) forming by the photolithographic method on the metal film formed in the first metal pattern, a second resist pattern including a pattern shape smaller than a pattern shape of the first resist pattern; and (e) etching the metal film with the second resist pattern to form a second metal pattern.

An organic EL display device (100) is provided with an element substrate (20) that has a substrate (1) and a plurality of organic EL elements (3) supported on the substrate, and a thin film encapsulation structure (10) that covers the plurality of organic EL elements. The thin film encapsulation structure is provided with a first inorganic barrier layer (12), an organic barrier layer (14) formed upon the first inorganic barrier layer, and a second inorganic barrier layer (16) formed upon the organic barrier layer. A first surface 14S of the organic barrier layer in contact with the second inorganic barrier layer has a plurality of fine first protrusions, and the maximum height Rz1 of the first surface roughness profile is 20 nm to less than 100 nm.

A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.

This organic EL device (100A) comprises a peripheral region (R2) and an active region (R1) containing a plurality of organic EL elements (3), and includes an element substrate (20) having a plurality of organic EL elements, and a thin film seal structure (10A) covering the plurality of organic EL elements. The thin film seal structure comprises a first inorganic barrier layer (12), an organic barrier layer (14) in contact with the upper surface of the first inorganic barrier layer, and a second inorganic barrier layer (16) in contact with the upper surface of the first inorganic barrier layer and the upper surface of the organic barrier layer. The peripheral region comprises a first protruding structure (22a) containing a section extending along at least one edge of the active region, and an extending section (12e) of the first inorganic barrier layer extending over the first protruding structure. The first protruding structure includes a first part and second part. The first part is closer to the top portion of the first protruding structure than the second part and, as observed from the normal direction to the base board, a cross section parallel to the substrate surface of the first part includes a part that does not overlap with the cross section parallel to the substrate surface of the second part.

In order to make a step of forming an coated-type polarizer easier, provided is a display device including, from a lower layer, a TFT layer, a light-emitting layer, a sealing layer, and a polarization layer in this order, in which the polarization layer includes a polymerizable liquid crystal layer containing a polymerizable liquid crystal into which a dichroic pigment is mixed and an alignment film coming in contact with a portion of the polymerizable liquid crystal layer to align the polymerizable liquid crystal contained in the polymerizable liquid crystal layer with which the alignment film is in contact, and in a display region, a region in which the polymerizable liquid crystal layer and the alignment film of the polarization layer come into contact with each other is a polarization portion, and in a frame region surrounding the display region, a region in which the polymerizable liquid crystal layer and the alignment film of the polarization layer do not come in contact with each other is a black frame portion.

A method for manufacturing an organic device 10 according to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layer 14 formed on a main surface 12a of a flexible substrate while continuously conveying the flexible substrate 12, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.