A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 m. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 m.

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Disclosed are an organic light-emitting diode and an organic light-emitting display device including the same. The organic light-emitting diode includes: a first electrode; a second electrode disposed opposite to the first electrode; a light-emitting layer disposed between the first electrode and the second electrode; a hole transport region disposed between the first electrode and the light-emitting layer; and an electron transport region disposed between the light-emitting layer and the second electrode; the hole transport region including at least two layers, and one of the at least two layers is in contact with the first electrode and is a self-crystallizing material-containing layer.

Disclosed are an organic light-emitting diode and an organic light-emitting display device including the same. The organic light-emitting diode includes: a first electrode; a second electrode disposed opposite to the first electrode; a light-emitting layer disposed between the first electrode and the second electrode; a hole transport region disposed between the first electrode and the light-emitting layer; and an electron transport region disposed between the light-emitting layer and the second electrode; the hole transport region including at least two layers, and one of the at least two layers is in contact with the first electrode and is a self-crystallizing material-containing layer.

According to a flexible OLED device production method of the present disclosure, a multilayer stack (100) is provided, the multilayer stack including a base (10), a functional layer region (20) which includes a TFT layer and an OLED layer, a flexible film (30) provided between the base and the functional layer region and supporting the functional layer region, and a dielectric multilayer film mirror (36) provided between the flexible film and the functional layer region. The flexible film is irradiated with lift-off light (216) transmitted through the base, whereby the flexible film is delaminated from the base.

A display device has a plurality of pixels each including a drive transistor and an electro-optical element. A defective pixel repairing method of the display device includes electrically connecting an anode electrode of the electro-optical element in a defective pixel with the anode electrode of the electro-optical element in an adjacent normal pixel of same color, by irradiating a laser to an overlapping portion of two wirings formed in different wiring layers and having the overlapping portion via an insulating film in a plan view, to short-circuit the two wirings, and electrically disconnecting, in the defective pixel, the drive transistor from the electro-optical element. With this, the defective pixel can be repaired easily.

A film thickness securing region of a green island-shaped hole transport layer in a display device is located at the inside of a green pixel light-emitting region in a direction in which a red pixel and a green pixel are adjacent to each other, and part of a shadow region of a red island-shaped hole transport layer and part of a shadow region of the green island-shaped hole transport layer overlaps each other within the green pixel light-emitting region.

A display device includes: a TFT layer including a metal layer and a protection layer protecting the metal layer in a layer above the metal layer; and a light-emitting layer, wherein the metal layer and the protection layer are formed to match each other.

A display device is disclosed. In one aspect, the display device includes a flexible substrate including a first region, a second region separated from the first region, and a bending region positioned between the first and second regions. The bending region is configured to be bent so as to have a plurality of different curvatures depending on degrees of bending of the flexible substrate. The display device also includes a first display unit positioned in the first region, a second display unit separated from the first display unit and positioned in the second region and an encapsulation layer positioned over the flexible substrate with the first and second display units interposed therebetween. The encapsulation layer directly contacts the bending region of the flexible substrate.