A display device including a resin layer, and a TFT layer being an upper layer with respect to the resin layer, wherein a bending section is provided on a peripheral edge, includes a terminal wiring line that is connected to a terminal in the TFT layer and passes through the bending section, and the terminal wiring line includes a first wiring line and a second wiring line that are positioned on both sides of the bending section, a third wiring line that passes through the bending section and is electrically connected with each of the first wiring line and the second wiring line, and a fourth wiring line that is formed in a layer different from that of the third wiring line and is electrically connected with each of the first wiring line and the second wiring line.

A thin film encapsulation structure included in an organic electroluminescent display apparatus includes a first inorganic barrier layer, an organic barrier layer in contact with the first inorganic barrier layer, and a second inorganic barrier layer in contact with the organic barrier layer. The thin film encapsulation structure is formed on an active region and the active region side portion of a plurality of lead wires extending from the active region to a terminal. Each of the lead wires at least partially includes, at at least the lowermost portions of two side surfaces thereof in contact with the first inorganic barrier layer, a forward tapering side surface portion having a tapering angle smaller than 90 degrees in a cross-section parallel to a line width direction thereof. The thin film encapsulation structure includes an inorganic barrier layer joint portion in which the organic barrier layer is not present, and the first inorganic barrier layer and the second inorganic barrier layer are in direct contact with each other. On the respective portions, of the lead wires, having the forward tapered side surface portions, the inorganic barrier layer joint portion is formed and the active region is completely enclosed by the inorganic barrier layer joint portion.

A problem to be addressed by the present invention is to obtain: a cured film that has high sensitivity, makes it possible to prevent generation of a development residue arising from a pigment, and has excellent heat resistance and light-blocking ability; and a negative photosensitive resin composition that is formed into the cured film. A main object of the present invention is to obtain and use a negative photosensitive resin composition including: (A) an alkali-soluble resin, (B) a radical polymerizable compound, (C) a photo initiator, and (Da) a black pigment; wherein the (A) alkali-soluble resin contains one or more selected from (A1-1) a polyimide, (A1-2) a polyimide precursor, (A1-3) a polybenzoxazole, and (A1-4) a polybenzoxazole precursor; and wherein the (C) photo initiator contains at least (C1) an oxime ester photo initiator and (C2) an -hydroxyketone photo initiator, wherein the content ratio of the (C1) oxime ester photo initiator is 51 to 95 mass % in the (C) photo initiator, and the content ratio of the (Da) black pigment is 5 to 50 mass % in all the solid contents of the negative photosensitive resin composition.

A method for manufacturing an organic electronic device according to one embodiment includes: a coating film formation step of applying a coating liquid for a functional layer having a predetermined function onto a plastic substrate to form a coating film; and a heating step of heating and curing the coating film by irradiating the coating film with infrared rays in an infrared heating furnace to form the functional layer. In the heating step, the coating film is heated and cured by the infrared rays while a member of the infrared heating furnace is cooled to 100 C. or less, the member being disposed around the plastic substrate so as to be separate from the plastic substrate.

A method for manufacturing an organic electronic device according to one embodiment includes: a coating film formation step of applying a coating liquid for a functional layer having a predetermined function onto a plastic substrate to form a coating film; and a heating step of heating and curing the coating film by irradiating the coating film with infrared rays in an infrared heating furnace to form the functional layer. In the heating step, the coating film is heated and cured by the infrared rays while a member of the infrared heating furnace is cooled to 100 C. or less, the member being disposed around the plastic substrate so as to be separate from the plastic substrate.

A method of manufacturing a display apparatus having an organic EL element includes: a step of forming the organic EL element over a substrate made of a flexible substrate; and a step of forming a protecting film 16 made of an inorganic insulating material so as to cover the organic EL element by using an ALD method. In the step of forming the protecting film 16, the protecting film 16 is formed by alternately performing a step of forming a high-density layer 16H by using an ALD method and a step of forming, by using an ALD method, a low-density layer 16L that has the same constituent element as the high-density layer 16H and has a lower density than the high-density layer 16H. The protecting film 16 has a layered structure made of one or more high-density layers 16H and one or more low-density layers 16L so that the low-density layer 16L and the high-density layer 16H are alternately layered so as to be in contact with each other.

A display device includes a display area configured by pixels including a light emitting area, and a frame area provided outside the display area. The display device includes a substrate, ribs formed separately in the display area and the frame area and arranged around the light emitting area in the display area and a mask support section that is disposed in the frame area and supports a film formation mask for forming a film at least above the ribs. A top portion of the mask support section is at least 10 m higher than a top portion of the ribs arranged in the display area in a thickness direction of the substrate.

The purpose of the present invention is to realize the display device having thin film transistors of the oxide semiconductor of stable characteristics. An example of the concrete structure is that: A display device having a substrate including a display area, plural pixels formed in the display area, the pixel includes a first thin film transistor having an oxide semiconductor film, a first insulating film made of a first silicon oxide on a first side of the oxide semiconductor film, a second insulating film made of a second silicon oxide on a second side of the oxide semiconductor film, wherein oxygen desorption amount per unit area from the first insulating film is larger than that from the second insulating film, when measured by TDS (Thermal Desorption Spectrometry) provided M/z=32 and a measuring range in temperature is from 100 centigrade to 500 centigrade.

Provided is a method of manufacturing a light emitting device, comprising: preparing a base body having a concave portion; disposing a light emitting element at the bottom of the concave portion; disposing a first resin containing first phosphor particles having an average particle size of 10 m or more and 30 m or less and a first filler having an average particle size of 5 m or more and 20 m or less to cover the light emitting element; centrifugally precipitating the first phosphor particles and the first filler toward the base body; temporarily curing the first resin; disposing a second resin containing second phosphor particles and a second filler having an average particle size of 5 nm or more and 100 nm or less on the first resin temporarily cured; centrifugally precipitating the second phosphor particles and the second filler toward the first resin; and curing the first and second resins.

According to an embodiment, a method for manufacturing an organic electronic device includes: a step of forming an organic functional layer 16 on a first electrode layer 14 provided for each of device formation regions DA set in a flexible substrate 10 in a first direction; a step of forming a second electrode layer 20 on the flexible substrate, on which the organic functional layer is formed, over the plurality of device formation regions in the first direction in such a way as to cover each organic functional layer; a step of forming a hole 22 by removing, in a second direction crossing the first direction, the second electrode layer provided between a boundary of the device formation region and a function exhibiting design region A1 in the organic functional layer in the first direction or on the second electrode layer on the boundary out of the second electrode layers; and a step of providing a sealing member 26 sealing the function exhibiting design region on the organic functional layer in such a way as to cover a surface of the hole on a side of the function exhibiting design region.