Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

A mother board includes a plurality of organic EL elements, each of the plurality of organic EL elements includes a first positive electrode terminal and a second positive electrode terminal that are electrically connected to the first electrode layer and a first negative electrode terminal and a second negative electrode terminal that are electrically connected to the second electrode layer, neighboring organic EL elements are arranged so that the first positive electrode terminal or the second positive electrode terminal and the first negative electrode terminal or the second negative electrode terminal face each other, and predetermined ones of the first positive electrode terminals or the second positive electrode terminals and the first negative electrode terminals or the second negative electrode terminals are electrically connected to each other by a connecting member so that the plurality of organic EL elements constitute a lighting unit.

A method of manufacturing a flexible display device, includes forming a base layer on a non-flexible substrate, the base layer including a first resin layer, an inorganic film, and a second resin layer, wherein the forming of the base layer includes a first step of forming the first resin layer inward from an end portion region of the non-flexible substrate, a second step of forming the inorganic film on the first resin layer such that the non-flexible substrate and/or the first resin layer is exposed, and a third step of forming the second resin layer in contact with the non-flexible substrate exposed from the inorganic film and/or the first resin layer exposed from the inorganic film, and the method further includes peeling the non-flexible substrate and bonding a flexible substrate to the first resin layer via an adhesive layer.

The present invention addresses the problem of providing a manufacturing method for an electronic device that is provided with an organic thin film functioning as a sealing film against moisture permeation in an electronic device such as an organic electroluminescence element. This manufacturing method for an electronic device is a manufacturing method for an electronic device that has at least an organic functional layer, an elution prevention film, and a sealing film in this order, said manufacturing method being characterized by having: a step in which, after coating is performed with a silicone resin, the result is irradiated with vacuum ultraviolet rays to form the elution prevention film; and a step in which, after the elution prevention film is coated with a liquid mixture of a metal alkoxide and a fluoroalcohol, the result is irradiated with vacuum ultraviolet rays to form the ultraviolet rays to form the sealing film.

The present invention addresses the problem of providing a manufacturing method for an electronic device that is provided with an organic thin film functioning as a sealing film against moisture permeation in an electronic device such as an organic electroluminescence element. This manufacturing method for an electronic device is a manufacturing method for an electronic device that has at least an organic functional layer, an elution prevention film, and a sealing film in this order, said manufacturing method being characterized by having: a step in which, after coating is performed with a silicone resin, the result is irradiated with vacuum ultraviolet rays to form the elution prevention film; and a step in which, after the elution prevention film is coated with a liquid mixture of a metal alkoxide and a fluoroalcohol, the result is irradiated with vacuum ultraviolet rays to form the ultraviolet rays to form the sealing film.

An organic EL light-emitting element is provided in which, by means of an organic material that is a oligomer with a molecular weight of 300-5000, an organic layer coated film 25 is formed in a high-definition pixel pattern in the openings 23a of insulation banks 23 that are formed with a hydrophilic material; a manufacturing method of said organic EL light-emitting element is also provided. The coated film 25 is formed by dropwise injection of a liquid composition containing an organic material oligomer.

An anti-glare film including a light reflectance of 3.8% or less and a transmission image clarity of 80% or less. The transmission image clarity of the anti-glare film may be from 5 to 70%. The anti-glare film includes a transparent substrate layer, and an anti-glare layer formed on at least one surface of the transparent substrate layer. The anti-glare layer may be a cured product of a curable composition including one or more types of a polymer component and one or more types of a curable resin precursor component, and in particular, at least two components selected from a polymer component and a curable resin precursor component can be phase separated through liquid phase spinodal decomposition. The anti-glare film can satisfactorily provide anti-reflection properties, anti-glare properties, and transparency.

A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 m.

An anti-glare film including a light reflectance of 3.8% or less and a haze of 40% or greater. A 60 gloss of the anti-glare film may be 15% or less. The anti-glare film includes a transparent substrate layer, and an anti-glare layer formed on at least one surface of the transparent substrate layer. The anti-glare layer may be a cured product of a curable composition including one or more types of a polymer component and one or more types of a curable resin precursor component, and in particular, at least two components selected from a polymer component and a curable resin precursor component can be phase separated through liquid phase spinodal decomposition. The anti-glare film has improved anti-reflection properties.

An anti-glare film is prepared which have an absolute value of a chromaticity b* of transmitted light being 15 or less and a haze being 30% or greater. In this anti-glare film, the absolute value of the chromaticity b* of transmitted light may be 3 or less and a 60 gloss may be 25% or less. The anti-glare film includes a transparent substrate layer, and an anti-glare layer formed on at least one surface of the transparent substrate layer. The anti-glare layer may be a cured product of a curable composition including one or more types of a polymer component and one or more types of a curable resin precursor component, and in particular, at least two components selected from a polymer component and a curable resin precursor component can be phase separated through liquid phase spinodal decomposition. This anti-glare film has little yellowness and high anti-glare properties.