Electroluminescent laminar luminaire comprising a laminar substrate (2), at least one flexible electroluminescent lamp (1) printed on the substrate (2), and electric power supply means of the EL lamp (1) housed together inside an encapsulating casing (8). The latter contains at least one hot-melt adhesive (HMA), preferably EVA, and accurately matches the external shape of the EL lamp (1) and the relief, and the electric power supply means that protrude from the substrate (2), covering them fully without leaving any gaps, constituting a closed, flexible, compact and fluid-tight luminaire (100).

Electroluminescent laminar luminaire comprising a laminar substrate (2), at least one flexible electroluminescent lamp (1) printed on the substrate (2), and electric power supply means of the EL lamp (1) housed together inside an encapsulating casing (8). The latter contains at least one hot-melt adhesive (HMA), preferably EVA, and accurately matches the external shape of the EL lamp (1) and the relief, and the electric power supply means that protrude from the substrate (2), covering them fully without leaving any gaps, constituting a closed, flexible, compact and fluid-tight luminaire (100).

To provide a charge injection layer in which the refractive index is sufficiently low and unbalance in the composition of materials is less likely to occur, and a method for its production as well as an organic photoelectronic element and a method for its production. The charge injection layer contains a fluorinated polymer and a semiconductor material, and has a refractive index in the wavelength range of from 450 to 800 nm, of at most 1.60.

A vapor deposition apparatus disclosed by an embodiment comprises: a vacuum chamber (8); a mask holder (15) for holding a deposition mask 1; a substrate holder (29) for holding a substrate for vapor deposition (2); an electromagnet (3) disposed above a surface; a vapor deposition source 5 for vaporizing or sublimating a vapor deposition material; and a heat pipe (7) including at least a heat absorption part (71) and a heat dissipation part (72), the heat absorption part being in contact with the electromagnet (3), and the heat dissipation part being derived to an outside of the vacuum chamber (8). The heat pipe (7) and the electromagnet (3) are in intimate contact with each other at an area of a contact part between the heat pipe (7) and the electromagnet (3), the area being equal to or more than a cross-sectional area within an inner perimeter of a coil (32).

A display device production method for producing a display device including a light emitting element in an active region and a terminal in a non-active region. The display device production method includes arranging a first mask overlapping with an electrode region of the light emitting element and a second mask overlapping with the terminal, on a conductive film that is arranged in the active region and the non-active region and that covers the terminal, and etching the conductive film.

A vapor deposition mask (100) includes a resin layer (10) having a first primary surface (11) and a second primary surface (12), and having a plurality of openings (13), and a metal layer (20) having a third primary surface (21) and a fourth primary surface (22), and provided on the first primary surface of the resin layer so that the fourth primary surface is located on the resin layer side, wherein the metal layer is shaped so that the plurality of openings are exposed therethrough. A portion of the first primary surface of the resin layer that is in contact with the metal layer, a portion of the first primary surface of the resin layer that is not in contact with the metal layer, and the third primary surface of the metal layer each include a rough surface region having a depressed/protruding shape.

A display device includes an organic insulating layer, a first inorganic insulating layer, and a second inorganic insulating layer arranged in a first region and a second region, a plurality of pixels arranged in the first region, a protective film arranged in the second region and in contact with an upper surface of the second inorganic insulating layer in the second region, and a groove portion is provided in the organic insulating layer in the second region. A side surface and a bottom surface of the groove portion is covered by the first inorganic insulating layer and the second inorganic insulating layer. The protective film is overlapped with an upper surface of the organic insulating layer and an upper end portion and a part of the side surface of the groove portion.

According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (212). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has ejection holes in a region which is to face the intermediate region (30i), from which a fluid is ejected in the separation step.

A manufacturing method of a display device includes a layering process including steps of forming a PI layer (3) on a carrier glass substrate (2), forming a base coat layer (4) to cover the PI layer (3), and forming a TFT layer (5) and a light-emitting element layer (6) on the base coat layer (4), an exposing process including a step of exposing an end surface of the PI layer (3), and a peeling process including a step of peeling the carrier glass substrate (2) from the PI layer (3) by irradiating the lower face of the PI layer (3) with a laser light beam.

The present invention is equipped with: a substrate (10) that has a surface upon which a drive circuit containing a TFT (20) is formed; a planarization film (30) that makes the surface of the substrate planar by covering the drive circuit; and an organic light-emitting element (40) that is provided with a first electrode (41) formed upon the surface of the planarization film and connected to the drive circuit, an organic light-emitting layer (43) formed upon the first to electrode, and a second electrode (44) formed upon the organic light-emitting layer. In addition, the planarization film has a two-layer structure comprising an inorganic insulating film (31) and an organic insulating film (32) that are layered upon the TFT, a conductor layer containing a titanium layer and a copper layer is embedded in the interior of a contact hole, and the first electrode is formed electrically connected to the conductor layer.