Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

A method for producing an organic EL device in this disclosure includes the steps of providing an element substrate including a substrate and a plurality of organic EL devices arranged on the substrate; and forming a thin film encapsulation structure over the element substrate. The step of forming the thin film encapsulation structure includes the steps of forming a first inorganic barrier layer over the element substrate; condensing a photocurable resin on the first inorganic barrier layer; irradiating a plurality of selected regions of the photocurable resin with a laser beam to cure at least a part of the photocurable resin, thus to form a photocurable resin layer; removing an uncured part of the photocurable resin; and forming a second inorganic barrier layer, covering the photocurable resin layer, on the first inorganic barrier layer.

An electroluminescent display device which may improve display quality is discussed. The electroluminescent display device includes a substrate in which a plurality of pixel areas are defined, a first electrode arranged in each pixel area, a light emitting layer on the first electrode within the pixel area, and a second electrode on the light emitting layer. Particularly, a step difference portion is arranged at an edge of the pixel area, and is partially or fully be filled with the light emitting layer. Film uniformity of the light emitting layer within the pixel area may be improved by arrangement of the step difference portion.

An electroluminescent display device which may improve display quality is discussed. The electroluminescent display device includes a substrate in which a plurality of pixel areas are defined, a first electrode arranged in each pixel area, a light emitting layer on the first electrode within the pixel area, and a second electrode on the light emitting layer. Particularly, a step difference portion is arranged at an edge of the pixel area, and is partially or fully be filled with the light emitting layer. Film uniformity of the light emitting layer within the pixel area may be improved by arrangement of the step difference portion.

Disclosed is a display device having a pixel including a pixel electrode, an electroluminescence layer over the pixel electrode, and an opposing electrode over the electroluminescence layer. The pixel electrode possesses: a first conductive layer including a conductive oxide containing indium and zinc; a second conductive layer over the first conductive layer, the second conductive layer containing silver; and a third conductive layer over the second conductive layer, the third conductive layer including a conductive oxide containing indium and tin. A thickness of the first conductive layer is equal to or more than twice a thickness of the third conductive layer and equal to or less than five times the thickness of the third conductive layer.

In a flexible OLED device production method, after an intermediate region and flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and intermediate region. The laser light is formed from a plurality of arranged laser light sources and irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate region and the glass base.

An organic EL display device including a plurality of pixels includes an element substrate including a substrate, and a plurality of organic EL elements supported by the substrate and respectively located in the plurality of pixels; and a thin film encapsulation structure covering the plurality of pixels. The thin film encapsulation structure includes a first inorganic barrier layer, an organic barrier layer in contact with a top surface of the first inorganic barrier layer, the organic barrier layer including a plurality of solid portions distributed discretely, and a second inorganic barrier layer in contact with the top surface of the first inorganic barrier layer and top surfaces of the plurality of solid portions of the organic barrier layer. The organic barrier layer is black.

A display device includes a substrate having an insulating surface, a pixel part having a plurality of pixels on the insulating surface, a terminal part including a first terminal arranged in a region outside the pixel part on the insulating surface, and a second terminal arranged in a region inside the first terminal, a wiring part including a first wiring arranged between the pixel part and the terminal part, a sensing part overlapped on the pixel part, and a sealing part covering the pixel part and the wiring part. The first wiring included in the wiring part is electrically connected to a first detection electrode at an opening provided in the second inorganic insulating layer, and the first wiring extends to an outer region of the second inorganic insulating layer and is electrically connected to the second terminal.

A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.