Patent classifications
H05F1/02
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
Transparent and antistatic conformal coating for internal ESD mitigation in space environment
An electronic device on a spacecraft that is enclosed by a conformal coating that is transparent and sufficiently conductive to conduct accumulated charge on the electronic device. The coating includes an intrinsic conducting polymer, such as PEDOT:PSS, dissolved, for example, in an organic solvent, and mixed with a polyurethane, such as Arathane 5750 or 5753.
MICROLAYER COEXTRUSION OF ELECTRICAL END PRODUCTS
A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.
MICROLAYER COEXTRUSION OF ELECTRICAL END PRODUCTS
A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.
ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.
ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.
Anti-ESD photomask and method of forming the same
The present disclosure provides an anti-ESD photomask and method of the same. In the method, a substrate is provided first. Then, a light-shielding layer is formed on a portion of the substrate, in which the light-shielding layer includes a Mo-containing layer. Next, a surface treatment operation is performed to convert a surface of the portion of the substrate and a surface of the light-shielding layer into a non-conductive layer.
Anti-ESD photomask and method of forming the same
The present disclosure provides an anti-ESD photomask and method of the same. In the method, a substrate is provided first. Then, a light-shielding layer is formed on a portion of the substrate, in which the light-shielding layer includes a Mo-containing layer. Next, a surface treatment operation is performed to convert a surface of the portion of the substrate and a surface of the light-shielding layer into a non-conductive layer.
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A display device and a method for manufacturing the display device are disclosed. An edge region of the display panel of the display device includes a first region in which an exposed connection line pattern is provided and a second region in which no connection line pattern is provided, and an electrostatic layer is attached to the edge region; wherein the electrostatic shielding layer comprises an insulating material region and a conductive material region, the insulating material region contacting the first region and the conductive material region contacting the second region.