An electronic device of the present invention is an electronic device used around a neutralization target object, the electronic device includes: an electric part; an interconnection portion that transmits electric power of a high voltage power supply to the electric part; and a housing that accommodates the electric part and the interconnection portion, in which the electronic device includes at least one of a cover portion, which covers at least a part of the electric part and has a surface resistivity of equal to or higher than 10.sup.4/ and equal to or lower than 10.sup.11/, and the housing, which has a surface resistivity of equal to or higher than 10.sup.4/ and equal to or lower than 10.sup.11/.

An electronic device of the present invention is an electronic device used around a neutralization target object, the electronic device includes: an electric part; an interconnection portion that transmits electric power of a high voltage power supply to the electric part; and a housing that accommodates the electric part and the interconnection portion, in which the electronic device includes at least one of a cover portion, which covers at least a part of the electric part and has a surface resistivity of equal to or higher than 10.sup.4/ and equal to or lower than 10.sup.11/, and the housing, which has a surface resistivity of equal to or higher than 10.sup.4/ and equal to or lower than 10.sup.11/.

An electronic device is provided. The electronic device includes a housing including an opening, a printed circuit board (PCB) disposed inside the housing, and a camera deco part disposed inside the opening and covering a camera assembly. The camera deco part includes a first metal portion having a first surface at least partially exposed to an outside of the electronic device, the first surface including an oxide coating layer, and a second surface including no oxide coating layer, a second metal portion having a third surface at least partially exposed to an outside of the electronic device, the third surface including an oxide coating layer, and a fourth surface including no oxide coating layer, the fourth surface facing the PCB, and a first adhesive portion located between the second surface of the first metal portion and the fourth surface of the second metal portion, the first adhesive portion including at least one recess.

An electronic device is provided. The electronic device includes a housing including an opening, a printed circuit board (PCB) disposed inside the housing, and a camera deco part disposed inside the opening and covering a camera assembly. The camera deco part includes a first metal portion having a first surface at least partially exposed to an outside of the electronic device, the first surface including an oxide coating layer, and a second surface including no oxide coating layer, a second metal portion having a third surface at least partially exposed to an outside of the electronic device, the third surface including an oxide coating layer, and a fourth surface including no oxide coating layer, the fourth surface facing the PCB, and a first adhesive portion located between the second surface of the first metal portion and the fourth surface of the second metal portion, the first adhesive portion including at least one recess.

A product including extruded multiple laminated flow streams using microlayer extrusion, and in particular products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.

A product including extruded multiple laminated flow streams using microlayer extrusion, and in particular products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.

A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.

A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.

A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.