A treadmill is provided according to various embodiments herein. The treadmill includes a frame; a front shaft coupled to the frame; a rear shaft coupled to the frame; and a running belt disposed about the front and rear shafts, wherein the running belt assumes at least a portion of a curved running surface, the curved running surface having a radius of curvature of approximately 88 to 138 inches.

A treadmill is provided according to various embodiments herein. The treadmill includes a frame; a front shaft coupled to the frame; a rear shaft coupled to the frame; and a running belt disposed about the front and rear shafts, wherein the running belt assumes at least a portion of a curved running surface, the curved running surface having a radius of curvature of approximately 88 to 138 inches.

An electronic component mounting device including a component tape in which a cover tape is adhered to a carrier tape accommodating multiple electronic components at a predetermined pitch; a tape feeder for feeding the component tape from a tape reel, with having a peeling mechanism for peeling the cover tape from the carrier tape at a component supply position; a mounting head configured to take out electronic components from the carrier tape at the component supply position and mount the electronic components on a board; and a tape collection portion in which a static charge elimination member is provided along a discharge path of the carrier tape from which the electronic components have been taken out, the discharge path being through a discharge duct from the tape feeder to a collection box.

An electronic component mounting device including a component tape in which a cover tape is adhered to a carrier tape accommodating multiple electronic components at a predetermined pitch; a tape feeder for feeding the component tape from a tape reel, with having a peeling mechanism for peeling the cover tape from the carrier tape at a component supply position; a mounting head configured to take out electronic components from the carrier tape at the component supply position and mount the electronic components on a board; and a tape collection portion in which a static charge elimination member is provided along a discharge path of the carrier tape from which the electronic components have been taken out, the discharge path being through a discharge duct from the tape feeder to a collection box.

The invention relates a method of creating a magnetically adhered, static dissipative floor covering (1), the method comprising the steps of:

providing a magnetically receptive floor surface (3);

providing a floor covering comprising a plurality of static dissipative, magnetic floor tiles (4), wherein the tiles (4) are held in place by magnetic interaction between the tiles (4) and the magnetically receptive surface (3).

Systems and methods of forming fiber reinforced polymer (FRP) composites with electrostatic dissipative properties are described herein. The FRP composite is bonded to a surface and integrates a grounding system to dissipate electro-static energy, thus eliminating the potential risk of explosion. The system can be used for structures that require reinforcement and that are susceptible to electro-static explosions.

Systems and methods of forming fiber reinforced polymer (FRP) composites with electrostatic dissipative properties are described herein. The FRP composite is bonded to a surface and integrates a grounding system to dissipate electro-static energy, thus eliminating the potential risk of explosion. The system can be used for structures that require reinforcement and that are susceptible to electro-static explosions.

An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

A method and apparatus for ensuring and tracking electrostatic discharge (ESD) safety and compliance via electronics that gather information and parameters from wearable electronics, such as a wrist strap, worn by each user at a company's electronics-manufacturing plant or similar facility that indicate whether and when a functional ESD ground is established and continually maintained between each respective user and each workstation at which each respective user locates, wherein a system monitor is configured to receive on a continual or periodic basis whether each user is complying with the ESD policy of the company. In some embodiments, the parts worked on at each workstation, billing and job numbers, and/or employee work hours are also tracked by a computer server that aggregates data from one or more system monitors and generates compliance reports for each part, job, and/or employee.