A static elimination device includes: a first static elimination member that makes contact with a medium that is transported; a second static elimination member arranged such that the medium is inserted between the first static elimination member and the second static elimination member; and a power source that applies a voltage to at least one of the first static elimination member or the second static elimination member, in which at least one of the first static elimination member and the second static elimination member has an elastic body.

A keyboard device includes a casing, a circuit board, plural keys and an electrostatic conduction module. The circuit board is disposed within the casing. The circuit board includes a ground terminal. The plural keys installed in the corresponding key slots of the casing. The electrostatic conduction module includes a first conductive element, an elastic conductive element and a second conductive element. The first conductive element is installed on a keycap of the key. The elastic conductive element is disposed within the casing and contacted with the circuit board. The second conductive element is connected between the first conductive element and the elastic conductive element. Moreover, electrostatic charges on the keycap are transferred to the circuit board through the first conductive element, the second conductive element and the elastic conductive element and discharged from the ground terminal of the circuit board.

A keyboard device includes a casing, a circuit board, plural keys and an electrostatic conduction module. The circuit board is disposed within the casing. The circuit board includes a ground terminal. The plural keys installed in the corresponding key slots of the casing. The electrostatic conduction module includes a first conductive element, an elastic conductive element and a second conductive element. The first conductive element is installed on a keycap of the key. The elastic conductive element is disposed within the casing and contacted with the circuit board. The second conductive element is connected between the first conductive element and the elastic conductive element. Moreover, electrostatic charges on the keycap are transferred to the circuit board through the first conductive element, the second conductive element and the elastic conductive element and discharged from the ground terminal of the circuit board.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

Disclosed is a static eliminator having an offset voltage reducing structure capable of improving antistatic performance for a charged body by reducing an ion offset voltage. The present static eliminator comprises a static eliminator body having an air passage through which high-pressure air is supplied, a plurality of discharge structures installed at the lower end of the static eliminator body to supply the high-pressure air passing through the air passage, and generating positive/negative ions by discharging using the applied high voltage, and an offset voltage reduction unit having a plurality of openings formed to allow the positive/negative ions and high-pressure air to pass therethrough, and installed to cover at least some of the plurality of discharge structures.

A medium transport device includes a transport section transporting a medium in a contact manner, an electrode detecting static electricity charged on the medium, and a static electricity detection circuit. The static electricity detection circuit includes a voltage clamp circuit clamping a detection signal input from the electrode to a predetermined voltage, an amplifier circuit amplifying an output signal of the voltage clamp circuit, a rectifier circuit rectifying an output signal of the amplifier circuit, and a comparator circuit serving as a determination circuit determining whether the medium exists based on an output signal of the rectifier circuit.

A medium transport device includes a transport section transporting a medium in a contact manner, an electrode detecting static electricity charged on the medium, and a static electricity detection circuit. The static electricity detection circuit includes a voltage clamp circuit clamping a detection signal input from the electrode to a predetermined voltage, an amplifier circuit amplifying an output signal of the voltage clamp circuit, a rectifier circuit rectifying an output signal of the amplifier circuit, and a comparator circuit serving as a determination circuit determining whether the medium exists based on an output signal of the rectifier circuit.

The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.

The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.