A flavor inhaler includes a control unit configured to control operation of the flavor inhaler; a main switch electrically connected to an input side of the control unit, the main switch configured to send a signal to the control unit to start operation of the control unit; and a sub switch electrically connected to the control unit, the sub switch configured to send a signal to the control unit to start supplying liquid from a liquid holding unit accommodating an aerosol base.

Embodiments of the present disclosure related to automated static control. A set of static sensor data may be obtained from two or more static sensors. The set of static sensor data may be analyzed to determine whether a static condition exists. In response to a determination that a static condition exists, a set of mobile static unit data may be collected from one or more mobile static units. The set of mobile static unit data may be analyzed to select a mobile static unit of the one or more mobile static units. An action may be transmitted to the selected mobile static unit, and the selected mobile static unit may be deployed to mitigate the static condition.

Embodiments of the present disclosure related to automated static control. A set of static sensor data may be obtained from two or more static sensors. The set of static sensor data may be analyzed to determine whether a static condition exists. In response to a determination that a static condition exists, a set of mobile static unit data may be collected from one or more mobile static units. The set of mobile static unit data may be analyzed to select a mobile static unit of the one or more mobile static units. An action may be transmitted to the selected mobile static unit, and the selected mobile static unit may be deployed to mitigate the static condition.

In a substrate processing apparatus, neutralization processing is performed on a substrate by a neutralization device provided in a thermal processing section. In the neutralization device, at least one of a holder that holds the substrate and an emitter that emits vacuum ultraviolet rays is moved relative to another one in one direction. At this time, one surface of the substrate is irradiated with the vacuum ultraviolet rays emitted by the emitter. When the entire one surface of the substrate is irradiated with the vacuum ultraviolet rays, the neutralization processing ends. Thereafter, the substrate on which the neutralization processing has been performed is transported to a coating processing unit in a coating processing section. In the coating processing unit, a film of a processing liquid is formed on the one surface of the substrate on which the neutralization processing has been performed.

In a substrate processing apparatus, neutralization processing is performed on a substrate by a neutralization device provided in a thermal processing section. In the neutralization device, at least one of a holder that holds the substrate and an emitter that emits vacuum ultraviolet rays is moved relative to another one in one direction. At this time, one surface of the substrate is irradiated with the vacuum ultraviolet rays emitted by the emitter. When the entire one surface of the substrate is irradiated with the vacuum ultraviolet rays, the neutralization processing ends. Thereafter, the substrate on which the neutralization processing has been performed is transported to a coating processing unit in a coating processing section. In the coating processing unit, a film of a processing liquid is formed on the one surface of the substrate on which the neutralization processing has been performed.

Disclosed is a wafer processing system, a load lock system, a chamber system, and methods of neutralizing static charges and dislodging particles from a wafer. The chamber system (e.g., load lock system) may comprise a chamber (e.g., load lock chamber), at least one ionizer to ionize inert gas supplied to the chamber (e.g., load lock chamber), at least one bottom nozzle to flow ionized inert gas to a bottom surface of a wafer, at least one top nozzle to flow ionized inert gas to a top surface of a wafer, and at least one exhaust vent to remove the ionized inert gas and any neutralized particles dislodged from the wafer. The chamber may include a single wafer or multiple wafers. The chamber system may further comprise at least one nozzle to flow an inert gas curtain proximate to an exit and/or entry into the chamber.

Disclosed is a wafer processing system, a load lock system, a chamber system, and methods of neutralizing static charges and dislodging particles from a wafer. The chamber system (e.g., load lock system) may comprise a chamber (e.g., load lock chamber), at least one ionizer to ionize inert gas supplied to the chamber (e.g., load lock chamber), at least one bottom nozzle to flow ionized inert gas to a bottom surface of a wafer, at least one top nozzle to flow ionized inert gas to a top surface of a wafer, and at least one exhaust vent to remove the ionized inert gas and any neutralized particles dislodged from the wafer. The chamber may include a single wafer or multiple wafers. The chamber system may further comprise at least one nozzle to flow an inert gas curtain proximate to an exit and/or entry into the chamber.

An example apparatus for charge neutralization includes: a first emitter nozzle; a power supply configured to supply a high frequency alternating current (AC) signal to the first emitter nozzle; control circuitry configured to: provide a polarity signal to the power supply to generate a DC offset signal, wherein a combination of the high frequency AC signal and the DC offset signal causes the power supply to output a positive ion generation pulse or a negative ion generation pulse; control the polarity signal to cause the power supply to provide a period of positive ion generation and a period of negative ion generation; determine a balance voltage at an output of the first emitter nozzle; and control the polarity signal to adjust a relative durations of the period of positive ion generation and the period of negative ion generation based on the balance voltage.

An example apparatus for charge neutralization includes: a first emitter nozzle; a power supply configured to supply a high frequency alternating current (AC) signal to the first emitter nozzle; control circuitry configured to: provide a polarity signal to the power supply to generate a DC offset signal, wherein a combination of the high frequency AC signal and the DC offset signal causes the power supply to output a positive ion generation pulse or a negative ion generation pulse; control the polarity signal to cause the power supply to provide a period of positive ion generation and a period of negative ion generation; determine a balance voltage at an output of the first emitter nozzle; and control the polarity signal to adjust a relative durations of the period of positive ion generation and the period of negative ion generation based on the balance voltage.

Automatic emitter point cleaners are disclosed. An automatic emitter point cleaning system includes: a fan configured to direct a stream of air through an air path; a point emitter configured to produce at least one of positive ions or negative ions within or proximate to the air path; a brush; a first gear coupled to the brush and configured to move the brush into contact with the point emitter; a second gear to engage the first gear; and a motor to actuate the second gear such that the second gear actuates the first gear to move the brush past the point emitter.