In frequency control where impedance matching is performed by frequency sweep in an RF power supply device, a frequency sweep direction is specified, allowing a reflection coefficient and/or reflected power to move to a minimum, whereby it is possible to reduce a time length required until detecting the frequency that enables the reflection coefficient and/or the reflected power to be minimized. The frequency control for impedance matching in the RF power supply device is performed according to the following two-stage control; A) phase control that specifies the frequency sweep direction that allows the reflection coefficient and/or the reflected power to move to a minimum, based on the phase state of oscillating frequency, and that starts increasing or decreasing the frequency in thus specified sweep direction; and B) reflected power control where the reflection coefficient or the reflection amount is used as a control end condition for completing the frequency control.

A plasma processing apparatus according to one embodiment includes a grounded processing container, a mounting table configured to support a workpiece inside the processing container, a plurality of electrodes arranged to face the mounting table and insulated from one another, a high frequency power supply configured to supply a high frequency power for generating plasma and electrically connected between two different electrodes out of the plurality of electrodes or between one of the plurality of electrodes and the processing container, and an impedance variable circuit configured to control an impedance and electrically connected between two different electrodes out of the plurality of electrodes or between one of the plurality of electrodes and the processing container.

The present disclosure provides a plasma reactor having a function of tuning low frequency RF power distribution, comprising: a reaction chamber in which an electrically conductive base is provided, the electrically conductive base being connected to a low frequency RF source via a first match, an electrostatic chuck being provided on the electrically conductive base, an upper surface of the electrostatic chuck being configured for fixing a to-be-processed substrate, an outer sidewall of the electrically conductive base being coated with at least one layer of plasma corrosion-resistance dielectric layer, a coupling ring made of a dielectric material surrounding an outer perimeter of the base, a focus ring being disposed above the coupling ring, the focus ring being arranged surround the electrostatic chuck and be exposed to a plasma during a plasma processing procedure; the plasma reactor further comprising an annular electrode that is disposed above the coupling ring but below the focus ring; a wire, a first end of which is electrically connected to the base, and a second end of which is connected to the annular electrode, a variable capacitance being serially connected to the wire.

An example system can include a radio-frequency power source, a resonator, and a plasma-distributing structure. The resonator can include an electrode having a first concentrator. The resonator can be configured to provide a plasma corona when excited by the power source with a signal having a wavelength proximate to an odd-integer multiple of one-quarter of a resonant wavelength of the resonator. The plasma-distributing structure can be arranged proximate to the plasma corona provided by the resonator and include a second concentrator. When the power source excites the resonator with the signal, an electric field can be concentrated at the first concentrator and the plasma corona can be provided proximate to the first concentrator. Further, when the plasma corona is provided proximate to the first concentrator and the plasma-distributing structure is at a predetermined voltage, an additional plasma corona can be established proximate to the second concentrator.

PROBLEM: To improve the stability of the process of the plasma ignition, by allowing a high current to pass through an induction coil without increasing the power-supply voltage in the process of the plasma ignition. SOLUTION: An impedance conversion circuit 16 including an inductor 17 and a capacitor 18 is arranged between a full-bridge drive circuit 13 for switching DC voltage and an LC resonance circuit 19 including an induction coil 21 for plasma generation. The capacitance of the capacitor 18 can be varied between two levels, with a switching driver 23 serving as a switcher. When the plasma is to be ignited, the capacitance of the capacitor 18 is set at the higher level to allow a high current to be supplied to the LC resonance circuit 19. After the plasma is brought into a steady state of lighting, the capacitance of the capacitor 18 is changed to the lower level at which an impedance matching is achieved so as to maximize the power efficiency.

Power supplies, waveform function generators and methods for controlling a plasma process are described. The power supplies or waveform function generators include a component for executing the method in which a waveform shape change index is determined during a plasma process and evaluated for compliance with a predetermined tolerance.

Example systems have a defrost system that can receive a first RF signal at a first frequency to defrost a load. An air treatment device can receive a second RF signal at a second frequency and perform an air treatment process. An RF signal source has a power output, and a switching arrangement selectively electrically connects the defrost system and the first air treatment device to the power output of the RF signal source. A controller can electrically connect one of the defrost system and the first air treatment device to the power output of the RF signal source. When the defrost system is electrically connected, the RF signal source outputs the first RF signal at the first frequency, and when the first air treatment device is electrically connected, the RF signal source outputs the second RF signal at the second frequency.

An integrated gas-enhanced electrosurgical generator. The generator comprises a high frequency power module, a low frequency power module and a gas module. The high frequency power module adapted to generate an electrical energy having a band of frequencies centered around a first frequency, wherein the electrical energy has a first power as the first frequency and a second power lower than the first power at a second frequency lower than the first frequency. The low frequency power module having an input connected to an output of the high frequency module. The low frequency module comprises a resonant transformer comprising a ferrite core, a primary coil and a secondary coil, the secondary coil having a larger number of turns than the primary coil, wherein the resonant transformer has a resonant frequency equal to the second frequency. The gas module is adapted to control a flow of an inert gas.

Methods, devices, and apparatus for generating plasma or laser pulses by radio frequency (RF) excitation pulses are provided. In one aspect, a method includes specifying radio frequency (RF) excitation pulses at least partially as a function of a preceding RF excitation of a medium and outputting a signal to a RF pulse generator, the signal configured to cause the RF pulse generator to generate the specified RF excitation pulses for exciting the medium to generate plasma or laser pulses. The RF excitation pulses is specified to become more strongly reduced in energy when a remaining excitation of the medium by the preceding RF excitation is higher.

A system that does conversion from regular hot plasma produced by ESU to cold plasma which is thermally harmless for the tissue. The system is comprised of Conversion Unit and Cold Plasma Probe. Output signal for ESU connects to CU along with Helium flow. The CU converts signal from ESU and send it to the output connector along with helium flow. Cold Plasma Probe is connected directly to the CU output. At the end of the CPP probe cold plasma is produced.