Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.

Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.

The present application relates to a device for treating skin using non-thermal plasma. It comprises a housing having a skin interface electrode for application to skin during treatment, a generator for generating non-thermal plasma at the skin interface electrode; and an isolating element to isolate a region surrounding said skin interface electrode other than during treatment so that non-thermal plasma generated at the skin interface electrode within said region sterilises the skin interface electrode.

An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.

The present application relates to a cold plasma device (13) for treating a surface (6) with cold plasma. The device (13) has a cold plasma generator (14) adapted to generate cold plasma that produces reactive species for treating the surface (6). The device (13) also includes a treatment head (5) that is positionable relative to the surface (6) such that the reactive species are imparted toward the surface (6) during treatment. The device (13) is also provided with an air flow generator (8) to generate an air flow over the surface (6) and a controller (9) configured to control operation of the air flow generator (8) to generate an air flow over the surface (6) after the treatment has been completed such that remaining by-products of the cold plasma are dissipated.

In an array of a plurality of plasma generator modules for generating a physical plasma by dielectric barrier discharges at atmospheric pressure, each of the plasma generator modules comprises two parallel electrodes linearly extending at a lateral distance, one of which having a dielectric barrier; connection devices for connecting the electrodes to a high voltage source; two flat gas-conducting elements conducting a working gas between the electrodes; and a module housing delimiting the respective plasma generator module laterally along the electrodes and transversely to the electrodes. The module housings are fixed to one another or to a common module frame by means of fixation devices. The module housings are arranged side by side both in a first direction along and in a second direction transverse to the electrodes, and in such an offset way that the electrodes of the plasma generator modules partially overlap in the direction along the electrodes.

A handheld plasma tool for controlled application of low temperature atmospheric pressure plasma to material surfaces, e.g. to enhance bonding and or cleaning. The handheld plasma tool can include a hand grip, on/off trigger, display, indicator lights, indexing pin, marking device, cable connections for gas supply and electrical power, and a plasma head for generating at least one reactive gas species at a low temperature. The handheld plasma tool can employ a rotatable clamp for treating backside surfaces. The handheld plasma tool can include motorized wheels to scan over a large area at a controlled speed. Other optional nozzles can also be employed for specialized applications.

The invention relates to a method for treating surfaces of an electronic card (4) by means of a plasma torch (1), said card (4) comprising a plurality of electronic components (C1a, C1b, C1c, C2a, C2b, C3a) and a plurality of surfaces to be treated, arranged at various heights relative to a reference plane (Ref) of the electronic card (4). At least one region to be treated (Zn) containing the surfaces to be treated is determined, strata (S1, S2, S3) which are parallel to said reference plane (Ref) and each contain at least one surface to be treated are determined, and then a torch movement path is generated such that: the surfaces are treated, stratum by stratum; for each stratum, the torch is exclusively moved in parallel with the reference plane (Ref); during the projection of the plasma flow (2), each treated surface is exclusively placed in the ideal working zone (Pt).

In an activated gas generation apparatus, metal electrodes are formed on a bottom surface of a dielectric electrode, and are disposed so as to face each other with a central region of the dielectric electrode interposed therebetween in plan view. The metal electrodes face each other along the Y direction. A wedge-shaped stepped part is provided so as to protrude upward in the central region on an upper surface of the dielectric electrode. The wedge-shaped stepped part is formed so as to have a shorter formation width in the Y direction as approaching each of a plurality of gas spray holes in plan view.

Embodiments disclosed herein include a plasma source, an abatement system and a vacuum processing system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source includes a dielectric tube and a coil antenna surrounding the tube. The coil antenna includes a plurality of turns, and at least one turn is shorted. Selectively shorting one or more turns of the coil antenna helps reduce the inductance of the coil antenna, allowing higher power to be supplied to the coil antenna that covers more processing volume. Higher power supplied to the coil antenna and larger processing volume lead to an improved DRE.