A torque-angle sensor includes a torque sensing unit, an angle sensing unit, and a PCB. The torque sensing unit includes a signal input rotor and a signal output rotor. The angle sensing unit includes a driving gear and a driven gear that is fitted round and fixed to one of the signal rotors. The PCB has a torque magnetic field generating unit, an input shaft signal collecting unit, and an output shaft signal collecting unit that sense a rotation angle and torque of the signal rotors. The PCB has an angle magnetic field generating unit and an angle collecting unit that sense a rotation angle of the driving gear and the driven gear. The torque magnetic field generating unit, the input shaft signal collecting unit, the output shaft signal collecting unit, the angle magnetic field generating unit, and the angle collecting unit are configured as coils formed by printed circuits.

A magnetic part according to an embodiment of the present invention comprises: a printed circuit board; a pattern coil formed on at least a surface of the printed circuit board; a core passing through the printed circuit board; and at least one winding coil disposed on at least a surface from among one surface and the other surface of the printed circuit board.

A phase shifter includes a printed circuit board and a trace located on the printed circuit board that is configured to transmit signals. The printed circuit board includes a first part covered by the trace and a second part not covered by the trace, where the second part includes at least one hollowed out area near the trace.

A circuit board having excellent reliability of connection between layers while being capable of achieving a compact and low-profile electronic device. In the circuit board has an LC circuit built therein with the use of a glass core having a through hole, a conductor layer formed in the through hole is connected to a wiring pattern formed on one surface of the glass core, and connected to a wiring pattern formed on the other surface of the glass core, with the conduction layer projected from the surface of the glass core. Thus, the area of contact between the conduction layer and the through hole is increased, thus making it possible to prevent the reliability of connection between layers in the through hole from being decreased, even when the glass core is reduced in thickness for achieving a low-profile device.

A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

A coil component includes a support substrate, a first coil and a second coil disposed on the support substrate to be spaced apart from each other, and a body including a first core and a second core penetrating through the first coil portion and the second coil portion and spaced apart from each other. The first coil portion has a first winding portion, forming at least one turn about the first core, and a first extension portion extending from one end portion of the first winding portion to surround the first core and the second core. The second coil has a second winding portion, forming at least one turn about the second core, and a second extension portion extending from one end portion of the second winding portion to surround the first core and the second core. A separation distance between a given turn of the first coil portion and an adjacent turn of the second coil portion is different from a separation distance between adjacent turns of the first coil portion.

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

A wiring board includes a pair of hard substrates provided for each of a plurality of semiconductor elements connected in parallel; a soft substrate provided so as to be at least partially sandwiched between all of the pairs of hard substrates; a first electrode configured to connect a control terminal of the semiconductor element and the hard substrate or the soft substrate; a second electrode configured to connect a reference potential terminal of the semiconductor element and the hard substrate or the soft substrate; a first wiring configured to connect in parallel the first electrodes of each of the plurality of semiconductor elements, at least part of the first wiring being provided on the soft substrate; and a second wiring configured to connect in parallel the second electrodes of each of the plurality of semiconductor elements, at least part of the second wiring being provided on the soft substrate.

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.