A snubber circuit includes a snubber substrate including an electrically insulating carrier and an electrically conducting structured layer applied thereon, the electrically conducting structured layer including two segments. The snubber circuit further includes two electrically resistive layers, each resistive layer being applied onto the two segments of the electrically conducting structured layer of the snubber substrate, and a capacitor disposed on the electrically resistive layers and having two terminals, each terminal being electrically connected to one of the electrically resistive layers. Further, a power semiconductor module having such a snubber circuit is disclosed.

A semiconductor device is detachably mountable on a measurement target that includes sensors provided on a predetermined surface thereof. The semiconductor device includes a wiring board having a first surface, and a second surface opposite to the first surface, a semiconductor integrated circuit mounted on the first surface of the wiring board, measuring spring terminals mounted on the second surface of the wiring board, and projections provided on the second surface of the wiring board. Each of the measuring spring terminals makes contact with a terminal connecting to a corresponding one of the sensors to electrically connect the terminal and the corresponding one of the sensors, and each of the projections makes contact with the measurement target, in a state where the semiconductor device is mounted on the measurement target so that the predetermined surface of the measurement target opposes the second surface of the wiring board.

A resistor-embedded circuit board and a method for processing the resistor-embedded circuit board are provided by the present disclosure. By opening an embedded-resistor cavity on a substrate, embedding a resistor into the embedded-resistor cavity to acquire a circuit board containing a built-in resistor. By opening the embedded-resistor cavity, it is very easy to realize high-precision control of a shape and a thickness of an embedded resistor, and realize very high-precision resistor-embedding; and it is easy to realize high-precision and massive processing. In a resistor-embedded layer, a resistor is built in a substrate. Then, in a process of pressing, a crack and a relatively large deformation will not be caused after pressing due to an irregular surface of the resistor-embedded layer, thereby improving a reliability and a quality rate of the circuit board.

The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.

The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

A capacitor may be configured with a dielectric laminate disposed on ordered or non-ordered structures. Materials for the dielectric laminate have high dielectric constant and reduce leakage current to increase breakdown voltage of the device. These materials may include titanium dioxide (TiO.sub.2) and silicon dioxide (SiO.sub.2). In one implementation, the capacitor may reside on a substrate. The capacitor may have structure (e.g., nano-tubes, nano-holes, etc;) disposed on the substrate having a surface area greater than the surface area of the substrate and a laminate conformally coating the structure, the laminate comprising a first layer and a second layer with materials that configure the capacitor with an energy density of at least 60 Wh/Kg.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.