A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.

Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.

A planar transformer includes a magnetic core having an internal opening. A plurality of high current capacity windings are disposed within the internal opening. These high current capacity windings have a length, a width and a thickness. Each winding is formed as an open loop having adjacent first and second end portions. There is at least one primary winding and one secondary winding. The primary winding and/or secondary winding may be high current capacity windings. A first terminal lead is electrically interconnected to multiple adjacent first end portions and a second terminal lead is electrically interconnected to multiple second end portions. Both the first terminal lead and said second terminal lead have a length, a width and a thickness measured with the thickness being less than either the terminal lead length or the terminal lead width.

A planar transformer includes a magnetic core having an internal opening. A plurality of high current capacity windings are disposed within the internal opening. These high current capacity windings have a length, a width and a thickness. Each winding is formed as an open loop having adjacent first and second end portions. There is at least one primary winding and one secondary winding. The primary winding and/or secondary winding may be high current capacity windings. A first terminal lead is electrically interconnected to multiple adjacent first end portions and a second terminal lead is electrically interconnected to multiple second end portions. Both the first terminal lead and said second terminal lead have a length, a width and a thickness measured with the thickness being less than either the terminal lead length or the terminal lead width.

A passive device packaging structure embedded in a glass medium according to an embodiment of the present disclosures includes a glass substrate and at least one capacitor embedded in the glass substrate. The capacitor includes an upper electrode, a dielectric layer, and a lower electrode. The glass substrate is provided on its upper surface with a cavity, the dielectric layer covers a surface of the cavity and has an area larger than that of the cavity. The upper electrode is provided on the dielectric layer. The dielectric layer and the lower electrode are connected by a metal via pillar passing through the glass substrate.

A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound onto a substrate. Subsequently, first portions of the photosensitive compound are exposed to a light pattern from a light source, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces the photosensitive compound to a metal layer. The unexposed second portions of the photosensitive compound may be rinsed away to leave the metal layer. Processing may continue to form an RFID circuit from the metal layer, and a completed RFID transponder comprising the RFID circuit.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.