Provided is a position detecting sensor formed by adhering, to one surface of a substrate, by an adhesive, a sensor pattern section having electrode conductors each formed in a predetermined conductor pattern and made of a wire formed by insulatively coating a conductor. The sensor pattern section includes a first loop coil group including loop coils arranged in a first direction at predetermined intervals, the loop coils including the wire wound a predetermined number of times, and a second loop coil group including loop coils arranged at predetermined intervals in a second direction orthogonal to the first direction. Each group of at least one loop coil of the first loop coil group and each group of at least one of loop coil of the second loop coil group are arranged in an alternately superposed manner, and are adhered to the substrate by the adhesive.

Provided is a position detecting sensor formed by adhering, to one surface of a substrate, by an adhesive, a sensor pattern section having electrode conductors each formed in a predetermined conductor pattern and made of a wire formed by insulatively coating a conductor. The sensor pattern section includes a first loop coil group including loop coils arranged in a first direction at predetermined intervals, the loop coils including the wire wound a predetermined number of times, and a second loop coil group including loop coils arranged at predetermined intervals in a second direction orthogonal to the first direction. Each group of at least one loop coil of the first loop coil group and each group of at least one of loop coil of the second loop coil group are arranged in an alternately superposed manner, and are adhered to the substrate by the adhesive.

The disclosure provides a power supply module, including: a pin; a magnetic core including: a first and second magnetic plate arranged in parallel; a first upper wiring layer; a first middle wiring layer; a first lower wiring layer, wherein at least a part of the first upper wiring layer and the first middle wiring layer are connected to form a first winding surrounding the first magnetic plate, at least a part of the first lower wiring layer and the first middle wiring layer are connected to form a second winding surrounding the second magnetic plate. The magnetic core, the first and second winding form a magnetic element electrically connected to a switch. A magnetic loop surrounds a first axis, the first winding surrounds a second axis, the second winding surrounds a third axis, the first, second and third axis are parallel to a plane where the pin is located.

The disclosure provides a magnetic element and a power supply module. The magnetic element includes a first and second magnetic column, a first winding formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part, and a second winding formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part sequentially connected. The first left/middle/right metal parts and the second left/middle/right metal parts are formed on a first substrate having a first upper and lower groove in which the first and second magnetic columns are disposed respectively. The magnetic element and the power supply module in the application use circuit boards having symmetric groove structures, the process is simple, thereby facilitating panel production mode, easy for automation, and lowering cost.

A method and system for manufacturing a coil for wireless charging are disclosed herein. The method may include manufacturing a printed circuit board, generating a coil-shaped metal pattern on the printed circuit board, and generating an additional metal pattern on the top of the metal pattern using a 3D metal printer.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.