The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, a plurality of disc-shaped light-emitting units, at least one disc-shaped light-emitting unit is disposed in at least one circular groove, and the at least one disc-shaped light-emitting unit includes an alignment element positioned on a top surface of the at least one disc-shaped light-emitting unit, a diameter of the at least one disc-shaped light-emitting unit is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the at least one disc-shaped light-emitting unit and the at least one rectangular groove satisfy the condition of (R+r)/2>(w.sup.2+H.sup.2).sup.1/2.

A rollable display device includes: a rollable display including a first end and a second end spaced apart from the first end; a first slider including a roller that supports the first end of the rollable display, the first slider being configured to roll the rollable display about the roller; and a second slider including a support that supports the second end of the rollable display while bending the second end of the rollable display, the second slider being slideable relative to the first slider.

Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include at least two integrated circuit dies that communicate using an embedded multi-die interconnect bridge (EMIB) in a substrate of the multi-chip package. The EMIB may receive power at contact pads formed at a back side of the EMIB that are coupled to a back side conductor on which the EMIB is mounted. The back side conductor may be separated into multiple regions that are electrically isolated from one another and that each receive a different power supply voltage signal or data signal from a printed circuit board. These power supply voltage signals and data signals may be provided to the two integrated circuit dies through internal microvias or through-silicon vias formed in the EMIB.

A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a laminate inlay embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the laminate inlay and configured to distribute a load current switched by the laminate inlay. A fourth metal layer is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

An electronic device is provided. The electronic device includes a housing and a display including a transparent plate forming a front of the electronic device, a display panel viewable from the front of the electronic device through the transparent plate, a panel flexible circuit film arranged under the rear surface of the display panel including a bending part that extends toward the front surface of the display panel in a region adjacent to a first side surface of the electronic device, the bending part being electrically connected to the display panel on the front surface of the display panel, and a first support member arranged between the rear surface of the display panel and the panel flexible circuit film, a partial region of the first support member having an area larger than that of the panel flexible circuit film within a designated distance from the first side surface.

The invention provides a card substrate for carrying a chip module, the card substrate has a first surface and a second surface opposite to the first surface, and a concave portion for accommodating the chip module, the concave portion includes a first concave portion, and a second concave portion further recessed from a bottom wall of the first concave portion, in a left-right direction, a size of the second concave portion gradually narrows from a middle to both sides, and in an up-down direction, the size of the second concave portion gradually narrows from the middle to both sides. The card substrate of the invention can provide good support and protect for the chip module.

The lens drive device provided according to the present disclosure includes a lens having an optical axis, a lens holder supporting the lens, an image stabilization frame, a base, and a drive component. The lens holder is elastically supported inside the image stabilization frame by a first elastic sheet, and the image stabilization frame is elastically supported on the base in the direction along the optical axis by a suspension component, where the suspension component includes a second elastic sheet and a suspension wire. The second elastic sheet includes a fixing portion and a suspension portion, and the suspension portion can be elastically deformed in the direction along the optical axis to buffer impact acted on the suspension wire. The lens drive device provided according to the present disclosure buffers the impact acted on the suspension wire by the suspension portion, so that the structural stability is provided.

The lens drive device provided according to the present disclosure includes a lens having an optical axis, a lens holder supporting the lens, an image stabilization frame, a base, and a drive component. The lens holder is elastically supported inside the image stabilization frame by a first elastic sheet, and the image stabilization frame is elastically supported on the base in the direction along the optical axis by a suspension component, where the suspension component includes a second elastic sheet and a suspension wire. The second elastic sheet includes a fixing portion and a suspension portion, and the suspension portion can be elastically deformed in the direction along the optical axis to buffer impact acted on the suspension wire. The lens drive device provided according to the present disclosure buffers the impact acted on the suspension wire by the suspension portion, so that the structural stability is provided.