Patent classifications
H05K1/18
Systems and methods of forming a video display
An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.
Keyboard device
A keyboard device includes a bottom cover, a supporting plate, a flexible circuit board and plural key structures. The supporting plate is installed on the bottom cover. The supporting plate has a curved arc-shaped profile that is bent upwardly in a direction away from the bottom cover. The supporting plate includes plural perforations. The flexible circuit board is arranged between the bottom cover and the supporting plate. The plural key structures are installed on the supporting plate. The plural key structures are penetrated through the corresponding perforations and contacted with the flexible circuit board.
Electrical junction box
An electrical junction box including: bus bars; a circuit board of which one side opposes the bus bars; a conductive portion that is provided on the one side of the circuit board, and is exposed from the other side of the circuit board; an opening that is provided in parallel with the conductive portion in the circuit board, and from which a portion of the bus bars is exposed; a switching element that is arranged on the other side of the circuit board, and of which an input terminal or an output terminal is connected to the conductive portion; and a conductive piece that is arranged straddling a portion of the bus bars and the conductive portion.
A Compact Oscillator Device with a Cavity Resonator on a Circuit Board
The present disclosure relates to an oscillator device (1, 1′, 1″, 1′″) comprising an active circuit device (2, 2′″), a circuit board (3) and a cavity resonator (4, 4′). The active circuit device (2, 2′″) comprises an amplifier unit (5), and the circuit board (3) comprises a first main side (6) and a 5 second main side (7), where the active circuit device (2, 2′″) is mounted to the first main side (6). The cavity resonator (4, 4′) is positioned on the second main side (7). The oscillator device (1) further comprises at least one excitation via connection (8) that runs through the circuit board (3) and electrically connects the active circuit device (2, 2′″) to an excitation structure (9) inside the cavity resonator (4, 4′).
Voice Coil Motor, Camera Module, and Electronic Device
A voice coil motor including a first magnetic piece, a second magnetic piece, a third magnetic piece, and a counterweight, with the first magnetic piece, the second magnetic piece, the third magnetic piece, and the counterweight radially and sequentially arranged around an optical carrier, a first plurality of coils symmetrically fastened on two sides of the optical carrier, where the first plurality of coils includes a first coil and a second coil, the first coil is disposed opposite the first magnetic piece, and the second coil is disposed opposite the third magnetic piece, a first magnetic sensor, and a first induction magnet disposed opposite the first magnetic sensor. The first magnetic sensor is disposed on a side of the counterweight that is adjacent to the optical carrier, and the first induction magnet is fastened on an outer wall of the optical carrier that is adjacent to the counterweight.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the inter-wiring distance between the closest two wirings of the wirings in the embedded wiring layer is in the range of 2 μm to 8 μm, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the inter-wiring distance.
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a through hole in a base material, forming a magnetic member by covering a conductor wire by a magnetic body, embedding the magnetic member in the through hole, and forming a plating film that covers end faces of the magnetic member exposed from the through hole.
Electronic device
An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.
Coil component, circuit board, and electronic device
A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode provided on the base body, a second external electrode provided on the base body, and a coil conductor electrically connected to the first and second external electrodes and extending around the coil axis. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, and the first and second conductor portions alternate with and are connected to each other, and a distance between the first conductor portions and the first surface is less than a distance between the second conductor portions and the second surface.
Printed circuit board comprising a plurality of power transistor switching cells in parallel
A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.