Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An electronic circuit module includes: a substrate on which a wiring pattern having an electrode portion is formed; a cable having an external insulator and a conductor portion, at least a distal end side of the external insulator being removed to expose a conductor, an exposed portion of the conductor being defined as the conductor portion; and an electronic component having terminals at least on two opposed faces of the electronic component. At least one of the terminals of the electronic component is directly connected to the conductor portion, and is configured to be electrically connected to the electrode portion through the conductor portion.

An electronic circuit module includes: a substrate on which a wiring pattern having an electrode portion is formed; a cable having an external insulator and a conductor portion, at least a distal end side of the external insulator being removed to expose a conductor, an exposed portion of the conductor being defined as the conductor portion; and an electronic component having terminals at least on two opposed faces of the electronic component. At least one of the terminals of the electronic component is directly connected to the conductor portion, and is configured to be electrically connected to the electrode portion through the conductor portion.

A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.

A wiring board with a filter circuit includes an insulating base, a conductor pattern, and a filter circuit. The conductor pattern is provided on the insulating base and defines the filter circuit. The insulating base includes an intermediate member, and first through third end members connected to the intermediate member. A first external connection terminal is provided on the first end member, and is disposed on a first end of the conductor pattern in the signal transmission direction. A second external connection terminal is provided on the second end member, and is disposed on a second end of the conductor pattern in the signal transmission direction. A first ground connection terminal that grounds the filter circuit is provided on the intermediate member. A second ground connection terminal that grounds the filter circuit is provided on the third end member.

A wiring board with a filter circuit includes an insulating base, a conductor pattern, and a filter circuit. The conductor pattern is provided on the insulating base and defines the filter circuit. The insulating base includes an intermediate member, and first through third end members connected to the intermediate member. A first external connection terminal is provided on the first end member, and is disposed on a first end of the conductor pattern in the signal transmission direction. A second external connection terminal is provided on the second end member, and is disposed on a second end of the conductor pattern in the signal transmission direction. A first ground connection terminal that grounds the filter circuit is provided on the intermediate member. A second ground connection terminal that grounds the filter circuit is provided on the third end member.

A refrigerator and a display for a refrigerator are provided. The display may include a display plate defining an outer appearance of a front surface of the display, a plurality of display portions that displays information of the refrigerator and is formed by an arrangement of a plurality of fine through-holes that pass through the display plate, a plurality of operational interfaces formed on a front surface of the display plate and operated by a touch input, a touch PCB provided on a rear surface of the display plate and including a plurality of touch sensors at positions corresponding to the plurality of operational interfaces, a display PCB on which a LED that radiates light toward the plurality of fine through-holes is mounted, and a display cover provided close to the rear surface of the display plate and on which the touch PCB and the display PCB are mounted.

The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.