A substrate cover has a conductive frame body covering a surface circumference edge region and an upper circumference region of a substrate drawn with a charged particle beam, the conductive frame body comprising a notch portion provided at part of an inner circumference of the conductive frame body, and a recessed portion provided on the outer circumference side of the upper surface of the conductive frame body, such that the recessed portion is arranged adjacent to the notch portion in a direction of a frame width of the conductive frame body, and a conductive member provided on the recessed portion so as to pass through the notch portion to project inward to the inside of the frame of the conductive frame body, the conductive member comprising a contact portion electrically connected to the surface of the substrate, and a brim portion covering an upper portion of a gap.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.

A mask including a plurality of baffles, a frame and a light transmission region, and a photo alignment method are provided. A support component and a movable component are disposed on the frame. The baffle is configured to block the light transmission region. The support component is configured to support the baffle which blocks the light transmission region. The movable component is configured to move the baffle to a position blocking the light transmission region.

Multiple designs for a multi-layer circuit may be simulated to determine impedance profiles of each design, allowing a circuit designer to select a design based on the impedance profiles. One feature that can be modified is the structure surrounding the barrels of a differential VIA on layers that are not connected to the differential VIA. Specifically, one antipad can be used that surrounds both barrels or two antipads can be used, with one antipad for each barrel. Additionally, the size of the antipad or antipads can be modified. These modifications affect the impedance of the differential VIA. Additionally, a conductive region may be placed that connects to the VIA barrel even though the circuit on the layer does not connect to the VIA. This unused pad, surrounded by a non-conductive region, also affects the impedance of the differential VIA.

The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.