There is a need for more effective and efficient printed circuit board (PCB) design. This need can be addressed by, for example, solutions for performing automated PCB component estimation. In one example, a method includes identifying a plurality of initial component estimations for the PCB; performing a shadow detection segmentation using the plurality of initial component estimations, a non-direct-lighting image, and one or more direct-lighting images to generate a first set of detected PCB components; performing a super-pixel segmentation using the plurality of initial component estimations and the non-direct-lighting-image to generate a second set of detected PCB components; and generating a bill of materials for the PCB based at least in part on the first set of detected PCB components and the second set of detected PCB components.

A design program for causing a computer to execute a process including: selecting, based on design data of a printed wiring board, a first transmission line and a second transmission line among transmission lines provided in the printed wiring board; adjusting a first wiring length between a first via in the first transmission line and a third via in the first transmission line, a second wiring length between a second via in the second transmission line and a fourth via in the second transmission line, a length of the first via, a length of the second via, a length of the third via, or a length of the fourth via such that a phase of first crosstalk noise generated between the first via and the second via is inverted between the third via and the fourth via; and outputting the design data corrected based on the adjustment in the board.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A method for designing PCB pads: using a drill bit of a first size to drill through a PCB from a first side; using a drill bit of a second size to back-drill a second side of the PCB so as to form a pyramid-shaped through hole; setting the connection means of a second layer and third layer of an inner layer of the PCB that comprises the pyramid-shaped through hole to full connection; and disposing a pad of a third size on a first layer of the inner layer, and disposing a pad of a fourth size on the last layer of the inner layer, wherein the fourth size is bigger than the third size, the fourth size is bigger than the second size, the second size is bigger than the first size, and the third size is bigger than the first size.

Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.