A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

An equipment automatic alignment method and a process robot device using the same are provided. The equipment automatic alignment method includes following steps. An image of an equipment is obtained. The image is enhanced to obtain a plurality of candidate patterns. Each of the candidate patterns is expanded to obtain a first rectangular block and a second rectangular block. A plurality of first target patterns are obtained according to the first rectangular block, and a plurality of second target patterns are obtained according to the second rectangular block. A first base point is obtained from the first target patterns, and a second base point is obtained from the second target patterns. An operation command is generated according to the first base point and the second base point to automatically control an operation interface of the equipment, so that the first base point is aligned with the second base point.

Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film.

A gantry-type positioning device includes first and second cross members. Two linear guides are disposed parallel to each other on a base and support the first and second cross members such that the cross members are movable in a first direction. A Y-carriage has a functional element and is supported on the first cross member such that the Y-carriage and the functional element are movable in a second direction. A position-measuring device is disposed on the second cross member and the Y-carriage such that a position of the Y-carriage relative to the second cross member is detectable. A Z-carriage supports the functional element such that the functional element is movable relative to the Y-carriage in a third direction. A further position-measuring device is disposed on the Y-carriage and the functional element such that a position of the functional element relative to the Y-carriage is detectable.

A circuit board system includes a circuit board having a base part (101) and at least one changeable part (102) furnished with at least one electrical component (103) such as a light emitting diode. The base part includes an aperture for receiving the changeable part so that a perpendicular of the changeable part is parallel with a perpendicular of the base part. The aperture is shaped to allow the position of the changeable part to be changed with respect to the base part when the changeable part is in the aperture, and edges of the aperture and the changeable part have mutually cooperative connection portions (105, 106) which allow the changeable part to be introduced on the aperture when the changeable part is in a first position and which limit freedom of the changeable part to get away from the aperture when the changeable part is in a second position.

An electronic component includes a main body and signal terminals projecting in a projection direction of a module control terminal, the signal terminals being arranged in an arrangement direction. Through-holes are formed in a control board, and the signal terminals are inserted into the through-holes. In a case, an opening that opens in the projection direction is formed, and ends of the signal terminals are positioned in the projection direction. At a position adjacent to a through-hole group including the through-holes in the arrangement direction, a communication space is formed which makes a first space, which is positioned at a side of electronic component in the projection direction, communicate with a second space opposite to the first space. When a length of the through-hole group is a, and a distance between the through-hole group and the communication space is b, a length of the communication space is longer than a+b.

A camera for a vehicle vision system includes a front housing portion, a circuit board, and a rear housing portion having a connector portion for connection of a vehicle coaxial cable. The circuit board includes a first solder pad for soldering a core pin connecting element, and a second solder pad that partially circumscribes the first solder pad for soldering a shielding connecting element. The second solder pad only partially circumscribes the first solder pad so as to have a gap between opposing ends of the second solder pad. The gap is configured to allow for escape of gases that evaporate out of the solder during the soldering process. The core pin connecting element electrically connects between a core pin of the connected coaxial cable and circuitry of the circuit board and the shielding connecting element electrically connects between shielding of the coaxial cable and circuitry of the circuit board.

There is provided a system 10 including at least one of inspection machines 20 and 22 and an NG board discharge machine 24 which moves an NG board to a checking position visible to a worker. The system 10 acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position. In this manner, it is not necessary to arrange the checking-purpose working machine adjacent of a downstream side of the inspection machines, and it is possible to arrange another working machine between the checking-purpose working machine and the inspection machine. In addition, even when the multiple inspection machines are arranged in the system, one checking-purpose working machine can correspond to the multiple inspection machines.

Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.