A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

A device for introducing patterns by radiating a wound continuous substrate. The device provides patterning during continuous roll-to-roll movement without material slippage and with minimal distortion by providing a dancer roll between a processing drum and an unwinder roll on one side, and a winder roll on the other side, for tautly guiding the continuous substrate along a contact surface of at least half of the circumference of the processing drum in order to drive the continuous substrate without slippage. The dancer rolls are adapted to tautly guide the advancing substrate web and returning substrate web with a constant force, and an equilibrium is adjustable between a defined counterforce and the constant action of force on the dancer roll by a stabilization device, and is maintained constant by a controller based on measured deflections of the dancer roll by controlling the rotational speed of the unwinder and winder rolls.

An alignment apparatus and an alignment detection method, which fall within a field of display technology, are disclosed herein. The alignment apparatus includes: a work table; a plurality of alignment rods provided on the work table, wherein a capacitor element is provided inside the alignment rod, and a capacitance of the capacitor element is changeable as the alignment rod deforms; and an alarm element connected to the capacitor element for giving an alarm when it receives a capacitance change value which exceeds a preset threshold value.

A camera for a vehicle vision system includes a front housing portion, a circuit board, and a rear housing portion having a connector portion for connection of a vehicle coaxial cable. The circuit board includes a first solder pad for soldering a core pin connecting element, and a second solder pad that partially circumscribes the first solder pad for soldering a shielding connecting element. The second solder pad only partially circumscribes the first solder pad so as to have a gap between opposing ends of the second solder pad. The gap is configured to allow for escape of gases that evaporate out of the solder during the soldering process. The core pin connecting element electrically connects between a core pin of the connected coaxial cable and circuitry of the circuit board and the shielding connecting element electrically connects between shielding of the coaxial cable and circuitry of the circuit board.

Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.

A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.

An optoelectronic component includes a carrier having an upper side which includes a first subarea and a second subarea, wherein the first subarea and the second subarea have different optical properties, and a method of producing an optoelectronic component includes providing a carrier having an upper side which includes a first subarea and a second subarea, and changing an optical property in the first subarea or in the second subarea.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.