A dispensing system for depositing material on an electronic substrate includes a frame, a dispensing unit gantry movably coupled to the frame, a dispensing unit coupled to the dispensing unit gantry, a vision system gantry coupled to the frame, and a vision system coupled to the vision system gantry. A controller is configured to manipulate the vision system with the vision gantry system to move to the position defined by a feature, to acquire an image of at least a portion of a feature, to search for an edge of interest along a center of the image, and to return a value indicating an offset of zero (0), which is interpreted as the location that is exactly as expected, and an offset that reflects where the edge of interest intersected that axis location.

A soldering apparatus includes a reflow oven, a transmission mechanism, and a controlling unit. The reflow oven includes an inlet and an output mechanism. The output mechanism includes two guide rails and two link belts. An end of a first guide rail has a first alignment structure. The two link belts are movably disposed on the guide rails for outputting a printed wiring board. A distance between the guide rails is previously adjusted to be equal to a width of the printed wiring board. The transmission mechanism includes two tracks and two conveyor belts. An end of a first track has a second alignment structure. The two conveyor belts are movably disposed on the two tracks for transporting the printed wiring board. The controlling unit controls a movement of the first track, so that the first alignment structure and the second alignment structure are automatically aligned with each other.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A component determination system for determining, in a case when a first component to be mounted on a board by a first mounting operation and a second component mounted on the board by a second mounting operation have a particular corresponding relationship, whether a combination of the first component and the second component mounted is permissible, the component determination system including: a first characteristic information acquiring section configured to acquire first characteristic information of the first component for which the first mounting operation has been completed; a second characteristic information acquiring section configured to acquire second characteristic information of the second component prepared prior to the second mounting operation; and a combination determining section configured to determine whether to allow the combination of the first component and the second component based on the acquired first characteristic information and the acquired second characteristic information.

Provided is a cover for pressing a printed circuit board on a heat sink, the cover comprising a metal sheet and one or more domes arranged in the metal sheet, wherein each dome is associated with one or more slits in the shape of ring segments in the metal sheet, the ring segment-shaped slits being provided in the metal sheet side by side and spaced apart from each other, the ring segment-shaped slits surrounding the dome they are associated with. At least at one end of each ring segment-shaped slit a slit extension may be provided in the metal sheet, the slit extension at least in part pointing away from the dome the ring segment-shaped slit is associated with. Further provided is an electronic appliance that includes such a cover, a heat sink and an electronic circuit board sandwiched there between.

A tray for a panel exposure machine, and also such a machine, enabling a panel to be retained and pressed down so as to be presented facing an exposure device. The tray comprises a work surface (13) adapted to receive panels of different sizes, said work surface (13) being substantially plane and possessing first and second adjacent edges (13a, 13b) extending along substantially orthogonal first and second directions (X, Y) defining a reference corner (C); and first and second holder devices (30a, 30b) of a first type and at least a first holder device (40a) of a second type, each holder device being actuatable between a holding, first state in which it exerts pressure directed towards the work surface (13), thereby defining a holding position, and a rest, second state in which said pressure is released; a positioning device (14) arranged along at least a portion of the first edge (13a) and along at least a portion of the second edge (13b); the holder devices (30a, 30b) of the first type extend along at least a portion of the first and second edges (13a, 13b) respectively, their holding positions being fixed in a plane parallel to the work surface; the holder device (40a) of the second type is movable in a plane parallel to the work surface (13) in order to adapt its holding position as a function of the size of the panel in use.

In a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is provided on the workpiece. In this arrangement, at least one reference (14), which can be brought into alignment with the mark (15), is provided in the work station (2).

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.