A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via the solder pads. The solder pads may include a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

The present disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool, in particular a drilling station for machining at least one circuit board, as well as to a method for controlling or identifying a platelike workpiece (1). The machining station has at least one X-ray radiation source (3), at least one detector (4) and a table (2) that can be positioned between the X-ray radiation source (3) and the detector (4), on which the workpiece (1) to be machined can be fastened. The table (2) has a receiving plate (6) made out of a material permeable to X-rays (5), in particular a plastic. The receiving plate (6) has at least one suction port (11) for extracting air and a distribution grid, which is connected in terms of flow with the at least one suction port (11) and consists of several channels (10) unilaterally open in a support surface (9) with beveled and/or rounded edges (13) and/or of inclinedly running through openings (14).

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.

A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

This application pertains to the technical field of LiDAR, and discloses a receiving optical system, a laser receiving module, a LiDAR, and an optical adjustment method. The receiving optical system includes an optical receiving module and a first cylindrical lens. The optical receiving module is configured to receive a reflected laser and focus the received reflected laser. The first cylindrical lens is configured to receive the focused reflected laser and adjust the reflected laser in a first direction. Therefore, the receiving optical system can better perform matching on the photosensitive surface of the receiving sensor, and the energy receiving efficiency of the system is relatively high.

A component determination system for determining, in a case when a first component to be mounted on a board by a first mounting operation and a second component mounted on the board by a second mounting operation have a particular corresponding relationship, whether a combination of the first component and the second component mounted is permissible, the component determination system including: a first characteristic information acquiring section configured to acquire first characteristic information of the first component for which the first mounting operation has been completed; a second characteristic information acquiring section configured to acquire second characteristic information of the second component prepared prior to the second mounting operation; and a combination determining section configured to determine whether to allow the combination of the first component and the second component based on the acquired first characteristic information and the acquired second characteristic information.

A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness of the circuit board. An imager is disposed at the first side of the circuit board and connecting circuitry is disposed at the second side of the circuit board. Solder pads are provided at the connecting circuitry at the second side of the circuit board. A coaxial connector is aligned at the solder pads at the connecting circuitry. The coaxial connector is soldered at the connecting circuitry via the solder pads. The solder pads may include a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector.