Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120 C. for 20 hours is 50 S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160 C. for 20 hours is 200 S/cm or less, can provide a thin insulating layer having excellent insulating properties.

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities, and further including a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Provided is a wearable flexible printed circuit board, in which a conductive circuit pattern is formed on a fiber web formed by accumulating fibers, and thus a base substrate has flexibility, resilience, waterproofness and air-permeability so as to be applied to future-oriented devices, a manufacturing method thereof, and a wearable smart device using the same. The wearable flexible printed circuit board includes: a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 m or less; and a conductive circuit pattern formed on the base substrate.

A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.

Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).

Methods and systems for recycling a printed circuit board (PCB). The printed circuit board is exposed to a swelling agent that causes an epoxy matrix of the printed circuit board to swell and disintegrate into particles. The particles of epoxy are then separated from the printed circuit board, leaving behind reinforcing fiber and metal containing components thereof. These remaining components are separated from each other and recycled separately using suitable processes. The epoxy particles are also recovered, and may be reduced to a monomer for use in synthesizing new epoxy. The swelling agent includes a carboxylic acid, preferably formic acid, as an active ingredient.

Methods and systems for recycling a printed circuit board (PCB). The printed circuit board is exposed to a swelling agent that causes an epoxy matrix of the printed circuit board to swell and disintegrate into particles. The particles of epoxy are then separated from the printed circuit board, leaving behind reinforcing fiber and metal containing components thereof. These remaining components are separated from each other and recycled separately using suitable processes. The epoxy particles are also recovered, and may be reduced to a monomer for use in synthesizing new epoxy. The swelling agent includes a carboxylic acid, preferably formic acid, as an active ingredient.

A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.

A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.