In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.

An electronic component assembly including a fixing part fixable to a first face on a first-direction side of an adherend, an electronic component, and a housing. The adherend has a housing hole opening in the first face. The housing includes a fixed portion fixed to the fixing part and a housing body to house the electronic component. The housing body includes a first portion disposed on a second-direction side relative to the fixing part. The second direction is opposite to the first direction. The first portion of the housing body has a dimension in the second direction that is equal to, or smaller than, a dimension in the second direction of the housing hole of the adherend. The first portion of the housing body is configured to be housed in the housing hole of the adherend.

Lighting modules and methods of manufacturing the same. The lighting module described herein may include a flexible printed circuit board substrate, light emitting diodes mounted on one side of the printed circuit board substrate, and thermally-conductive substrate plates opposite of the light emitting diodes to provide structural support and thermal management.

Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.

Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.

The invention, which relates to an arrangement (1) for the active suppression of interference signals, addresses the problem of specifying an arrangement (1) for the active suppression of interference signals, with which the reliable and secure compensation of the EMC interferences is achieved, which has a lower installation space requirement, generates less interference emission and is cost-effective of production. This problem is resolved thereby that beneath the main circuit board (12) disposed on the surface of the housing (10) a recess (14) is disposed and that in this recess (14) a circuit board (15) for the active EMC filter (4) is emplaced.

Locks, systems and methods of monitoring a lock, the lock having a hub with a slot rotatable by a handle to open and close a latchbolt. A locking member is moveable into and out of engagement with the hub slot to prevent and permit movement of the hub and latchbolt. A sensor on the lock, adjacent the hub and locking member, monitors a moving lock component. The sensor may sense the position of the locking member in or out of engagement with the hub slot. The sensor may be a reed switch actuated by a magnet on the moving lock component. The lock may further include a magnet mounted on the hub and the sensor may comprise a reed switch capable of being actuated by the magnet on the hub. The lock and system may include an external control unit having an alarm for controlling operation of the lock.

A control unit for an apparatus, the control unit comprising: a component-carrying member provided with at least one electronic component configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit; and a laminate encapsulation layer encapsulating at least a part of the or each electronic component. Optionally, the control unit comprises a second member which defines a user-interaction surface.

Flexible lighting apparatus and method of manufacturing the same disclosed. The flexible light apparatus includes a net-structured flexible printed circuit board (FPCB), being manufactured in shape of net structure in which a plurality of through-holes are formed separately from each other in a body of the net-structured FPCB, and having predetermined circuit patterns formed thereon, a plurality of light sources, being mounted on at least one of predetermined mounting location among intersection and branch of the net-structured FPCB, and a supporting layer, having apertures formed thereon and being fixed to support the net-structured FPCB at bottom surface.