A method for producing a semiconductor module, involving the steps: providing a carrier plate and a substrate having a bonding layer arranged on a surface of the carrier plate or the substrate, applying adhesive in multiple adhesive areas of the carrier plate or the substrate which are free from the bonding layer, positioning the substrate on the carrier plate such that the substrate and the carrier plate are in contact with the bonding layer and the adhesive, and joining the substrate and the carrier plate across the bonding layer by melting or sintering of the bonding layer.

According to a first aspect, there is provided a computer structure comprising a first silicon substrate and a second silicon substrate. Computer circuitry configured to perform computing operations is formed in the first silicon substrate, which has a self-supporting depth and an inner facing surface. A plurality of distributed capacitance units are formed in the second silicon substrate, which has an inner facing surface located in overlap with the inner facing surface of the first substrate and is connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces. The inner facing surfaces have matching planar surface dimensions. The second substrate has an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage. The second substrate has a smaller depth than the first substrate.

One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second maskmirrored image of the first maskto a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.

A method for forming a laminated structure of a touch panel, the method comprising: after forming a metal line and a bridge line, adding a metallization additive, and metallizing plating the metal line and the bridge line. The present invention is applied to a transparent conductive layer with bridge lines, metal lines, and T-bar. The metal line and the bridge line are fabricated in the same layer, which can reduce the processes and reduce the material cost, and the metallization plating after forming can reduce the stretching effects of the conductive material.

A keyboard includes a first substrate, a second substrate, a keyswitch circuit, a connecting member, and a keyswitch assembly. The first substrate has a first through hole. The second substrate is disposed on the first substrate and has a second through hole. The second through hole is connected to the first through hole and located within an inner edge of the first through hole. The keyswitch circuit is disposed on one of the first substrate and the second substrate. The connecting member is engaged with the second through hole and extended onto a bottom surface of the second substrate facing toward the first substrate. The keyswitch assembly is located on a top surface of the second substrate facing away from the first substrate, connected to the connecting member, and configured to trigger the keyswitch circuit.

Disclosed is an energy harvesting apparatus which comprises: a flexible energy harvesting module having a flat plate shape; a connector which is mechanically and electrically connectable to an external connector; a rigid member having a flat plate shape; and an electric wiring constituting a part of a front surface of the rigid member, wherein an edge of a back surface of the energy harvesting module is disposed on the front surface of the rigid member, and the connector is disposed on the front surface of the rigid member at a position spaced apart from the energy harvesting module and is electrically connected to the energy harvesting module via the electric wiring.

A keyboard includes a first substrate, a second substrate, a keyswitch circuit, a connecting member, and a keyswitch assembly. The first substrate has a first through hole. The second substrate is disposed on the first substrate and has a second through hole. The second through hole is connected to the first through hole and located within an inner edge of the first through hole. The keyswitch circuit is disposed on one of the first substrate and the second substrate. The connecting member is engaged with the second through hole and extended onto a bottom surface of the second substrate facing toward the first substrate. The keyswitch assembly is located on a top surface of the second substrate facing away from the first substrate, connected to the connecting member, and configured to trigger the keyswitch circuit.

A human-like tactile perception apparatus for providing enhanced tactile information (feedback data) from an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus's base structure is attached to the gripper's finger and includes a flat/planar support plate that presses a pressure sensor array against a target object during operable interactions. The pressure sensor array generates pressure sensor data that indicates portions of the array contacted by surface features of the target object. A sensor data processing circuit generates tactile information in response to the pressure sensor data, and then transmits the tactile information to the robotic system's control circuit. An optional mezzanine connector extends through an opening in the support plate to pass pressure sensor data to the processing circuit. An encapsulating layer covers the pressure sensor array and transmits pressure waves generated by slipping objects to enhance the tactile information.

Provided herein is a magnetic sheet. The magnetic sheet according to one embodiment of the present invention includes a magnetic layer formed of crushed pieces of a magnetic body to improve flexibility of the magnetic sheet, and a thin film coating layer formed on at least one surface of the magnetic layer to maintain the magnetic layer in a sheet shape and buffer an external force applied to the crushed pieces of the magnetic body. According to the present invention, since the magnetic sheet is improved in mechanical strength properties, such as a tensile property, a bending property, and the like, to have significantly superior flexibility, degradation of physical properties, such as magnetic permeability and the like, caused by physical damage such as unintended cracks in the magnetic body provided in the magnetic sheet can be prevented even in the process of storing, transferring, and attaching the magnetic sheet to a target object and during usage of an electronic device provided with the target object to which the magnetic sheet is attached, and the magnetic sheet can be attached to a target surface of the target object with a superior adhering force even when a stepped portion is present at the surface, and at the same time, the magnetic sheet can block the influence of a magnetic field on parts of a portable terminal device or a human body of a user using the portable terminal device, significantly increase transmission and reception efficiencies and distances of a data and/or wireless power signal, and maintain the above-described performance for a long period of time, such that the magnetic sheet can be widely used in various portable devices such as mobile devices, smart appliances, devices for the Internet of Things, and the like.

A component assembly that includes a connection between two components, in particular an electronic circuit board and a housing. The connection includes a pin-shaped connector via which the electronic circuit board is held on the housing, and the pin-shaped connector in a passage of the housing being connected to the housing via a housing caulking. The pin-shaped connector, in the area of the housing caulking, includes a recess that cooperates with the housing caulking in such a way that the pin-shaped connecting means is held in the passage.