Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.

Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.

A multilayer substrate includes a laminate, signal conductors, and external connection conductors. The signal conductors are at different positions in a lamination direction of the laminate. The external connection conductors are provided on a back surface of the laminate. A first signal conductor is connected at one end to one of the external connection conductors by a first wiring conductor. A second signal conductor is connected at one end to one of the external connection conductors by a second wiring conductor. The first signal conductor is closer to the back surface than the second signal conductor. The first wiring conductor includes wiring adjusting conductors each having a length corresponding to a distance difference in the lamination direction between the first and second signal conductors.

A flexible display device includes a flexible substrate that includes a first side; a display unit disposed in a first region of the first side and that includes a plurality of pixels; and a pad portion disposed in a second region of the first side and that includes a plurality of pad electrodes. The flexible substrate includes a stepwise recess portion disposed along an edge of the first side on which end portions of the pad electrodes are provided.

A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.

A device for bending sheets includes a first abutting member and a second abutting member fixedly connected to an outside surface of the sheet. The second abutting member is rotatably connected to the first abutting member. A rotating position and a locking position are provided at the connection between the first abutting member and the second abutting member. The first abutting member and the second abutting member are capable of rotating relative to each other at the rotating position, and the first abutting member and the second abutting member are capable of being interlocked with each other at the locking position. The first abutting member and the second abutting member are interlocked so as to obtain a desired curvature of the sheet. The present invention further provides an LED module and a display screen.

A display device is disclosed, which includes a circuit board having a fixing slot; a backlight module, wherein the backlight module includes a back plate, and the back plate is provided with a circuit board fixing mechanism, and the circuit board fixing mechanism includes a group of holes, a first hole of the group of holes is aligned with the fixing slot; an elastic pressing piece, which is provided with an engaging portion for engaging with the group of the holes and a connecting portion for pressing the circuit board onto the back plate. The engaging portion of the elastic pressing piece passes through the fixing slot of the circuit board and the hole group of the back plate to fix the circuit board onto the backlight module. The fixing method can avoid scratching the circuit board during the fixing process, and the fixing process is simple and convenient.

An electrical system with conductive and insulating layers for application to a surface of a garment is disclosed. The electrical system includes a first insulating layer for attaching to a garment, a second insulating layer, and an electrically conductive layer encapsulated between the first insulating layer and the second insulating layer. The first and second insulating layers have a predetermined minimum voltage withstand and a predetermined minimum resistance.

A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.