An electrical system comprising conductive and insulating layers for application to a surface of a garment, the electrical system comprising: a first insulating layer for attaching to a garment; a second insulating layer; and an electrically conductive layer encapsulated between the first insulating layer and the second insulating layer. The first and second insulating layers have a predetermined minimum voltage withstand and a predetermined minimum resistance.

A method for producing a semiconductor module, involving the steps: providing a carrier plate and a substrate having a bonding layer arranged on a surface of the carrier plate or the substrate, applying adhesive in multiple adhesive areas of the carrier plate or the substrate which are free from the bonding layer, positioning the substrate on the carrier plate such that the substrate and the carrier plate are in contact with the bonding layer and the adhesive, and joining the substrate and the carrier plate across the bonding layer by melting or sintering of the bonding layer.

A laser hat with an adjustable fit is provided, which includes a hat body, a plurality of laser modules, a flexible printed circuit board and an adjustment mechanism. The hat body is made of a honeycomb structure. A woven mesh can be used on an inner layer of the hat body. The plurality of laser modules are disposed on the flexible printed circuit board. The flexible printed circuit board is disposed in the hat body and drives the plurality of laser modules, which are used to irradiate a user's head to stimulate hair follicles, and can also be used for laser acupuncture and laser health care treatments for the head. The adjustment mechanism is disposed on one side of the hat body that can be used to adjust a hat fit.

The present disclosure provides a semiconductor device in which adherence of solder balls to an insulating circuit board and an insulating layer is prevented. The semiconductor device includes a base plate, the insulating circuit board, and particulate matter. The insulating circuit board includes an upper surface holding a semiconductor element, and a lower surface bonded to a front surface of the base plate via a bonding material. The particulate matter adheres to the front surface of the base plate located more outward than the insulating circuit board in a plan view. The bonding material has conductivity. The particulate matter is made of a material identical to that of the bonding material.

Disclosed is an energy harvesting apparatus which comprises: a flexible energy harvesting module having a flat plate shape; a connector which is mechanically and electrically connectable to an external connector; a rigid member having a flat plate shape; and an electric wiring constituting a part of a front surface of the rigid member, wherein an edge of a back surface of the energy harvesting module is disposed on the front surface of the rigid member, and the connector is disposed on the front surface of the rigid member at a position spaced apart from the energy harvesting module and is electrically connected to the energy harvesting module via the electric wiring.

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.

A light source module includes a light-emitting cell, a wiring structure provided on the light-emitting cell and connected to the light-emitting cell, a support structure that is apart from the light-emitting cell with the wiring structure therebetween in a vertical direction, a printed circuit board (PCB) that is apart from the wiring structure with the support substrate therebetween in the vertical direction and overlapping the light-emitting cell in the vertical direction, and at least one insulating film that is apart from the wiring structure in the vertical direction and covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the PCB.

Systems and methods are provided for monitoring object placement on a surface. The system includes a pressure-sensitive conductive sheet. The pressure-sensitive conductive sheet includes a stretchable fabric, having a plurality of fibers, and a conductive material positioned on a plurality of adjoining fibers of the stretchable fabric. The system further includes a 3-dimensional structure positioned under the pressure-sensitive conductive sheet. The 3-dimensional structure includes one or more depressions onto which the stretchable fabric can be stretched and the conductive material is positioned over the one or more depressions.

A conductive transfer and method of producing the conductive transfer is described. The conductive transfer comprises two non-conductive layers and a conductive layer between the two non-conductive layers and at least one electrical component in electrical communication with the conductive layer. The conductive layer includes a power trace for providing a power source to the electrical component and a data trace for providing the electrical component with an electrical signal.