A touch panel includes: a uni-axially oriented base film; a transparent electrode pattern layer positioned on the uni-axially oriented base film; a first passivation layer formed in an edge region of the transparent electrode pattern layer and covering end portion side walls of the transparent electrode pattern layer; and a contact hole positioned on the first passivation layer and exposing the first passivation layer.

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

An arrangement, a method of manufacturing component carriers and a component carrier are provided. The arrangement includes a central carrier structure having a front side and a back side, a first layer stack having a first surface structure made of another material than the interior of the first layer stack and covered by a first release layer which is attached to the front side, and a second layer stack covered by a second release layer which is attached to the back side.

Touch sensor layer constructions and methods of making such constructions are described. More particularly, touch sensor constructions that utilize patterned conductive layers that may be applied by a sacrificial release liner, eliminating one or more glass and/or film substrate from touch sensor stacks, and methods of making such constructions are described.

A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

A method of manufacturing a component carrier, includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure.

According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

Provided are a polyamic acid solution that can be formed into a film without peeling even when the film is thick and can be stably stored at room temperature, and a laminate that can be suitably used for production of a flexible device. In the alkoxysilane-modified polyamic acid solution according to the present invention, an additive amount of an alkoxysilane compound that contains an amino group is more than 0.050 parts by weight and less than 0.100 parts by weight.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.