A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

Disclosed is a surface treatment device. The surface treatment device includes: a frame; a disc hanger; two support wheels for supporting the disk hanger; a rotation drive mechanism for driving the disk hanger supported on the two support wheels to rotate; a vertical spray rack for spraying liquid medicine on the circuit board on the disk hanger; and a lift mechanism for driving the vertical spray rack up and down.

A pressing member includes a base, a first pressing portion, and a second pressing portion. The first pressing portion and the second pressing portion are arranged on a same surface of the base. The base is provided with a first hole. The first pressing portion includes a first contact surface facing away from the base. The first contact surface defines a second hole extending toward the base and communicating with the first hole to cooperatively define a channel. The second pressing portion includes a second contact surface facing away from the base. The second contact surface and the first contact surface are arranged on a same plane.

A printed circuit board homogenization treatment device includes a load mechanism, a position mechanism and a drive mechanism. The load mechanism is disk-shaped and configured to fix the printed circuit board; the position mechanism at least includes a first position wheel and a second position wheel that can jointly support the load mechanism; the position mechanism is switchable between a first state and a second state; when the position mechanism is in the first state, the load mechanism and the drive mechanism are spaced apart; when the position mechanism is in the second state, the drive mechanism is configured to drive the load mechanism to rotate around its central axis; both the first position wheel and the second position wheel are configured to rotate with rotation of the load mechanism.

The objective of the present invention is to provide a precision filter which is suitable for filtering a circuit board production process liquid, which is extremely excellent in the resistance to both a strongly acidic cleaning liquid and a strongly alkaline cleaning liquid and which is extremely excellent in the capability of removing an extremely fine foreign substance. Also, the objective of the present invention is to provide a precision filter cartridge which is used for a circuit board production process liquid and which includes the precision filter. Further, the objective of the present invention is to provide a method for producing a circuit board using the process liquid filtered by the precision filter for a circuit board production process liquid or the precision filter cartridge for a circuit board production process liquid. The precision filter to filtrate a process liquid for producing a circuit board according to the present invention is characterized in comprising a tetrafluoroethylene copolymer (I) having an amino group in a side chain.

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

There is provided a contact structure, comprising a substrate contact including a first contact portion that is located on a leading end side of the substrate contact and that comes into contact with a substrate and a second contact portion that is located nearer to a base end side of the substrate contact than the first contact portion; a seal member configured to cover a periphery of the substrate contact and to have a sealing surface that comes into contact with the substrate to seal the substrate contact; a first pressing portion configured to elastically apply a contact pressure on the substrate to the substrate contact; and a second pressing portion configured to come into contact with the seal member and to apply a contact pressure on the substrate to the seal member independently of the first pressing portion, wherein the first contact portion adheres to the seal member, and the second contact portion is fit in the seal member to be displaceable relative to the seal member.

A jetting dispenser includes an actuator with a piezoelectric unit that lengthens by a first distance in response to an applied voltage, and an amplifier operatively coupled to the piezoelectric unit. The amplifier includes first and second ends and the second end moves through a second distance, larger than the first distance under the applied voltage. First and second springs are positioned on opposite sides of the piezoelectric unit. The springs are coupled to the piezoelectric unit in a manner that maintains the piezoelectric unit under constant compression. A fluid body includes a movable shaft operatively coupled with the second end of the amplifier and includes a fluid bore and an outlet orifice. The movable shaft is moved by the second end of the amplifier under the applied voltage and jets an amount of fluid from the fluid bore through the outlet orifice.